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NXP Semiconductors N.V. Philips
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Part No. |
BSP030-04 BSP030
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OCR Text |
...ambient Conditions mounted on a metal clad substrate; Figure 4 mounted on a printed circuit board; minimum footprint Value 15 100 Unit K/W K/W
7.1 Transient thermal impedance
03ac21
102 Zth(j-sp) (K/W) 10
= 0.5
0.2 0.1
1
0.0... |
Description |
N-channel TrenchMOS intermediate level FET N沟道 TrenchMOS 中间级场效应 N-channel enhancement mode field-effect transistor From old datasheet system
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File Size |
156.22K /
13 Page |
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it Online |
Download Datasheet |
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Teledyne Technologies
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Part No. |
RF100-5
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OCR Text |
...bility. ? broader bandwidth. ? metal enclosure for emi shielding. ? ground pin option to improve case grounding. ? high isolation between c...clad, reinforced ptfe, rt/duroid ? 6002 with sma connectors. (rt/duroid ? is a registered tradema... |
Description |
(RF100 / RF103) HIGH REPEATABILITY ULTRAMINIATURE CENTIGRID RELAY BROADBAND DC TO RF
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File Size |
120.39K /
4 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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