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  conductivity Datasheet PDF File

For conductivity Found Datasheets File :: 4587    Search Time::1.078ms    
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    PS21997-4 PS21997-4A PS21997-4C PS21997-4W

Mitsubishi Electric Semiconductor
Part No. PS21997-4 PS21997-4A PS21997-4C PS21997-4W
OCR Text ...te 3 : Grease with good thermal conductivity and long-term quality should be applied evenly with +100m~+200m on the contacting surface of DIPIPM and heat sink. The contacting thermal resistance between case and heat sink (Rth(c-f)) is deter...
Description Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE

File Size 181.13K  /  11 Page

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    AMIS-30532 AMIS30532C53212G AMIS30532C5321RG

ON Semiconductor
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Part No. AMIS-30532 AMIS30532C53212G AMIS30532C5321RG
OCR Text ...area of 5500 mm2 copper and 20% conductivity * The 2 power internal planes: 36 mm thick copper with an area of 5500 mm2 copper and 90% conductivity The Rthja for 1S0P is simulated conform to JEDEC JESD- as follows: -51 * A 1--layer printed ...
Description Micro-Stepping Motor Driver

File Size 565.79K  /  29 Page

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    AN-0003

ANADIGICS, Inc
Part No. AN-0003
OCR Text ...), but due to its lower thermal conductivity, it requires more consideration than si to remove heat. the thermal conductivity of gaas is only about one third that of si, and it has a nonlinear relationship with temperature (the conductiv...
Description Thermal Considerations for Power Amplifiers

File Size 306.11K  /  6 Page

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    AMIS-30542 AMIS30542C54212G AMIS30542C5421RG

ON Semiconductor
Part No. AMIS-30542 AMIS30542C54212G AMIS30542C5421RG
OCR Text ...area of 5500 mm2 copper and 20% conductivity * The 2 power internal planes: 36 mm thick copper with an area of 5500 mm2 copper and 90% conductivity The Rthja for 1S0P is simulated conform to JEDEC JESD-51 as follows: * A 1-layer printed cir...
Description AMIS-30542 Micro-Stepping Motor Driver

File Size 419.37K  /  29 Page

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    PS21993-4 PS21993-4A PS21993-4C PS21993-4W

Mitsubishi Electric Semiconductor
Part No. PS21993-4 PS21993-4A PS21993-4C PS21993-4W
OCR Text ...te 3 : Grease with good thermal conductivity and long-term quality should be applied evenly with +100m~+200m on the contacting surface of DIPIPM and heat sink. The contacting thermal resistance between case and heat sink (Rth(c-f)) is deter...
Description Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE

File Size 174.36K  /  10 Page

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    PS21994-4 PS21994-4A PS21994-4C PS21994-4W PS21994-411

Mitsubishi Electric Semiconductor
Part No. PS21994-4 PS21994-4A PS21994-4C PS21994-4W PS21994-411
OCR Text ...te 3 : Grease with good thermal conductivity and long-term quality should be applied evenly with +100m~+200m on the contacting surface of DIPIPM and heat sink. The contacting thermal resistance between case and heat sink (Rth(c-f)) is deter...
Description Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE

File Size 174.37K  /  10 Page

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    Tripp Lite. All Rights Reserved
Part No. P450-006
OCR Text ...s and contacts provide superior conductivity. features db9 female to db9 female full handshake null wiring configuration: 1+6 - 4, 2-3, 3-2, 4 - 1+6, 5-5, 7-8, 8-7. superior molded cables with foil-shielding for maximum emi/rfi protection g...
Description Null Modem Serial RS232 Cable (DB9 F/F) 6-ft.

File Size 482.42K  /  3 Page

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    NCP1608 NCP1608BDR2G

ON Semiconductor
Part No. NCP1608 NCP1608BDR2G
OCR Text ...opper Clad) Junction-to-Air Low conductivity PCB (Note 3) , Junction-to-Air High conductivity PCB (Note 4) , Operating Junction Temperature Range Maximum Junction Temperature Storage Temperature Range Lead Temperature (Soldering, 10 s) Symb...
Description Critical Conduction Mode PFC Controller Utilizing OTA

File Size 248.75K  /  24 Page

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    PSM05S93E5-A

Mitsubishi Electric Semiconductor
Part No. PSM05S93E5-A
OCR Text ...te 2: grease with good thermal conductivity and long - term endurance should be applied evenly with about +100m~+200m on the contacting surface of dipipm and heat sink. the contacting thermal resistance between dipipm case and heat si...
Description Dual-In-Line Package Intelligent Power Module

File Size 415.56K  /  11 Page

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    PSM03S93E5-A

Mitsubishi Electric Semiconductor
Mitsubishi Electric Sem...
Part No. PSM03S93E5-A
OCR Text ...te 2: grease with good thermal conductivity and long - term endurance should be applied evenly with about +100m~+200m on the contacting surface of dipipm and heat sink. the contacting thermal resistance between dipipm case and heat si...
Description Dual-In-Line Package Intelligent Power Module

File Size 415.38K  /  11 Page

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