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Amphenol Communications Solutions |
| Part No. |
10118085-101-12LF
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| Description |
Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10119333-101-15LF
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| Description |
BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0878345045 87834-5045
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13渭m (5渭) Gold (Au) Selective Plating
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| File Size |
120.74K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10114829-10110LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87834-5041 0878345041
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating
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| File Size |
112.73K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114831-10113LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114831-10114LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0878340841 87834-0841
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating
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| File Size |
112.00K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114829-10114LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114828-10115LF
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| Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114830-10111LF
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| Description |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114829-10115LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114831-10115LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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