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Rochester Electronics LLC |
| Part No. |
AM27C010-55DI
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| Description |
AM27C010 - CMOS EPROM 1 Megabit (128K x 8)
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
AM27C010-55JC
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| Description |
AM27C010 - CMOS EPROM 1 Megabit (128K x 8)
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
AM27C010-55PI-G
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| Description |
AM27C010 - EPROM - OTP, EPROM - UV 1Mbit 128k x 8
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| Tech specs |
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Official Product Page
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Molex, Inc.
MOLEX INC
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| Part No. |
08-50-0028 08-58-0105 08-58-0118 08-58-0187 08-50-0189
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| Description |
KK 156 TERM CRP 18-20 AWG TRIFURCON TIN BRASS, TIN (200) OVER COPPER FINISH, WIRE TERMINAL
KK 156 TERM CRP 18-20 AWG TRIFURCON GOLD PHOSPHOR BRONZE, GOLD (15) OVER NICKEL FINISH, WIRE TERMINAL
KK 156 TERM CRP 18-20 AWG TRIFURCON GOLD PHOSPHOR BRONZE, GOLD (30) OVER NICKEL FINISH, WIRE TERMINAL
Solderless Terminal; Body Material:Brass; Contact Plating:Tin; Series:6838; Wire Size (AWG):20-18; External Depth:0.11"; Lead Pitch:3.96mm; Operating Temp. Min:0 C; Voltage Rating:250V RoHS Compliant: Yes
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| File Size |
220.48K /
3 Page |
 View
it Online |
Download Datasheet
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Rochester Electronics LLC |
| Part No. |
MC10105P
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| Description |
MC10105 - OR/NOR Gate, 10K Series, 3-Func, 3-Input, ECL, PDIP16
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-436HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-434HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-432HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-431HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-435HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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TRIPATH[Tripath Technology Inc.]
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| Part No. |
TA0105A
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| Description |
STEREO CLASS-T DIGITAL AUDIO AMPLIFIER DRIVER USING DIGITAL POWER PROCESSING (DPPTM ) TECHNOLOGY
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| File Size |
355.93K /
29 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
78511-433HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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