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  43650-1121 Datasheet PDF File

For 43650-1121 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    43650-0404

Molex Electronics Ltd.
Part No. 43650-0404
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with Press-fit Metal Retention Clip, 4 Circuits

File Size 152.15K  /  3 Page

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Murata Manufacturing Co Ltd

Part No. MHM411-21
Description Ionizer Module, 100-120VAC-input, Negative Ion
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    43650-0925

Molex Electronics Ltd.
Part No. 43650-0925
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Solder Tab, 9

File Size 170.66K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-112122500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-0403

Molex Electronics Ltd.
Part No. 43650-0403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with Press-fit Metal Retention Clip, 4 Circuits

File Size 152.09K  /  3 Page

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Amphenol Communications Solutions

Part No. 91911-21121LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 21 Positions, 1.00mm ( 0.039in) Pitch.
Tech specs    

Official Product Page

    43650-0902

Molex Electronics Ltd.
Part No. 43650-0902
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with Snap-in Plastic

File Size 161.32K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-112142100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-0621

Molex Electronics Ltd.
Part No. 43650-0621
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit Metal

File Size 164.23K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-112162500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-0700

Molex Electronics Ltd.
Part No. 43650-0700
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with Snap-in

File Size 161.25K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-111121000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-0610

Molex Electronics Ltd.
Part No. 43650-0610
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with PCB

File Size 163.37K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-111121850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43650-0903

Molex Electronics Ltd.
Part No. 43650-0903
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with Press-fit Metal Retention

File Size 152.10K  /  3 Page

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Amphenol Communications Solutions

Part No. CEC001121112100
Description Double Density Cool Edge Cable 0.8mm,112 signal pins,32AWG high speed cable,RA VS RA,Cable length of 100mm
Tech specs    

Official Product Page

    43650-0904

Molex Electronics Ltd.
Part No. 43650-0904
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Right Angle, with Press-fit Metal Retention Clip, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 152.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-107400900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SD-43650-004 43650-0709

Molex Electronics Ltd.
Part No. SD-43650-004 43650-0709
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with PCB Press

File Size 162.97K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-110102000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 43650-1121 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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