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  16861A-008 Datasheet PDF File

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    90-0082

Maxim Integrated Products
Part No. 90-0082
Description PACKAGE LAND PATTERN, (T1032N-1 / T1032N 1)

File Size 17.66K  /  1 Page

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HUA FENG CIRCUIT





    CN-0082

Analog Devices
Part No. CN-0082
Description Creating a Constant Envelope Signal Using the ADL5331 RFVGA and AD8319 Log Detector

File Size 262.75K  /  4 Page

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    14-60-0088

Molex Electronics Ltd.
Part No. 14-60-0088
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version D, Back Ribs, Wire Size 24, 3.81μm (150μ) Tin/Lead (SnPb), 8 Circuits

File Size 159.54K  /  3 Page

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    3008

Molex Electronics Ltd.
Part No. 3008
Description KK Maxi-3.96mm & 5.08mm Modular Interconnection System

File Size 58.33K  /  2 Page

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    HMC-C008

Hittite Microwave Corporation
Part No. HMC-C008
Description 15 WATT POWER AMPLIFIER MODULE, 1.8 - 2.2 GHz

File Size 821.44K  /  6 Page

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    ADC-008A-X

Adam Technologies, Inc.
Part No. ADC-008A-X
Description DC POWER JACK

File Size 71.05K  /  1 Page

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    Vishay
Part No. IMC-1008
Description High Q/SRF Wirewound Inductor

File Size 117.97K  /  2 Page

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPT-18-8008
Description Temperature Compensated Amplifier 8 GHz - 18 GHz

File Size 883.54K  /  2 Page

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    MOLEX INC
Part No. 016-02-0083
Description TIN (75) OVER NICKEL FINISH, WIRE TERMINAL

File Size 55.19K  /  1 Page

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    MOLEX INC
Part No. 008-55-0125
Description BRASS, GOLD FINISH, WIRE TERMINAL

File Size 76.57K  /  1 Page

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