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  1118-228 Datasheet PDF File

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    0011-18-5170 001118-5170

Molex Electronics Ltd.
Part No. 0011-18-5170 001118-5170
Description Conductor Punch
File Size 14.41K  /  1 Page

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Amphenol Communications Solutions
Part No. U77A11181001
Description SFP CAGE 1X1 TIN TRAY
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    11-18-4391 001118-4391 0011-18-4391

Molex Electronics Ltd.
Part No. 11-18-4391 001118-4391 0011-18-4391
Description Combination Anvil
File Size 19.29K  /  1 Page

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Amphenol Communications Solutions
Part No. U77C11181011
Description BRIGHT TIN PLT/R EMI PIN
Tech specs 　 　

Official Product Page

    11-18-5373 0011-18-5373 001118-5373

Molex Electronics Ltd.
Part No. 11-18-5373 0011-18-5373 001118-5373
Description Insulation Anvil
File Size 16.05K  /  1 Page

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Amphenol Communications Solutions
Part No. 68491-118HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0011-18-5208 001118-5208

Molex Electronics Ltd.
Part No. 0011-18-5208 001118-5208
Description Conductor Punch
File Size 11.48K  /  1 Page

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Amphenol Communications Solutions
Part No. 77311-118-09LF
Description BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions
Tech specs 　 　

Official Product Page

    11-18-5205 0011-18-5205 1118-5205 001118-5205

Molex Electronics Ltd.
Part No. 11-18-5205 0011-18-5205 1118-5205 001118-5205
Description Insulation Punch
File Size 14.53K  /  1 Page

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Amphenol Communications Solutions
Part No. 77311-118-19LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    0011-18-5328 1118-5328 001118-5328

Molex Electronics Ltd.
Part No. 0011-18-5328 1118-5328 001118-5328
Description Insulation Anvil
File Size 16.19K  /  1 Page

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Amphenol Communications Solutions
Part No. 77311-118-29LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    001118-5327 0011-18-5327

Molex Electronics Ltd.
Part No. 001118-5327 0011-18-5327
Description Insulation Punch
File Size 14.53K  /  1 Page

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Amphenol Communications Solutions
Part No. 54111-118021450LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0011-18-5112 001118-5112

Molex Electronics Ltd.
Part No. 0011-18-5112 001118-5112
Description Insulation Punch
File Size 14.48K  /  1 Page

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Amphenol Communications Solutions
Part No. 54111-802030850LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0011-18-5168 001118-5168

Molex Electronics Ltd.
Part No. 0011-18-5168 001118-5168
Description Conductor Anvil
File Size 16.07K  /  1 Page

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Amphenol Communications Solutions
Part No. 54111-807051000LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    11-18-5237 0011-18-5237 1118-5237 001118-5237

Molex Electronics Ltd.
Part No. 11-18-5237 0011-18-5237 1118-5237 001118-5237
Description Conductor Punch
File Size 14.40K  /  1 Page

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Amphenol Communications Solutions
Part No. 10111837-P020001LF
Description Mini-SAS Cable Assemblies, Input Output Connectors, Out-port to In-port Keying, 8 Signal Pairs, 26 Positions.
Tech specs 　 　

Official Product Page

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