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SHCPA60 MURX0560 TC7SET17 2SK34 BUZ32 MURX0560 C9692 2SD1978
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    TJ150F06M3L

Toshiba Semiconductor
Part No. TJ150F06M3L
OCR Text ...rop the packed devices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moistu...
Description MOSFETs

File Size 279.88K  /  10 Page

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    MCIMX356AVM4B

Freescale Semiconductor, Inc
Part No. MCIMX356AVM4B
OCR Text ...Notice * -- High-speed CD ripping to USB, SD/MMC or HDD for virtual CD changer -- Audio processing for hands-free telephony: Bluetooth, AEC/NS, Microphone beam forming, and so on. -- Speech recognition A/V Connectivity and Navigation ...
Description Multimedia Applications Processor for Automotive Products

File Size 1,529.64K  /  140 Page

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    TOSHIBA
Part No. TK100F04K3L
OCR Text ...rop the packed devices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moistu...
Description Power MOSFET (N-ch single 30V<VDSS≤60V)

File Size 281.48K  /  10 Page

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    TK100F04K3L

Toshiba Semiconductor
Part No. TK100F04K3L
OCR Text ...rop the packed devices to avoid ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moistu...
Description MOSFETs

File Size 281.51K  /  10 Page

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