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  MSRX-1823 Datasheet PDF File

For MSRX-1823 Found Datasheets File :: 134+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |   

    CVCO33BE-1823-1903

CRYSTEK CORPORATION
Part No. CVCO33BE-1823-1903
Description VCO (voltage controlled oscillator)

File Size 66.66K  /  2 Page

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Rochester Electronics LLC

Part No. CDP1823CD/B
Description CDP1823 - 128X8 SRAM
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HAL1821 HAL1822 HAL1823 HAL182Y

Micronas
Part No. HAL1821 HAL1822 HAL1823 HAL182Y
Description Linear Hall-Effect Sensor Family

File Size 157.41K  /  2 Page

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Amphenol Communications Solutions

Part No. 77315-118-23LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 23 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    14-45-1823 0014451823

Molex Electronics Ltd.
Part No. 14-45-1823 0014451823
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 23 Circuits

File Size 141.70K  /  2 Page

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Amphenol Communications Solutions

Part No. 71918-234
Description Quickie Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, 34 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    K7P401823B

Samsung semiconductor
Part No. K7P401823B
Description 128Kx36 & 256Kx18 SRAM

File Size 342.74K  /  13 Page

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Amphenol Communications Solutions

Part No. 54122-112182300LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 18 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0872631823 87263-1823

Molex Electronics Ltd.
Part No. 0872631823 87263-1823
Description 1.00mm (.039") Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filledBlack Housing, Phosphor Bronze, 0.38渭m (15渭") Gold (Au) Plating, with Plastic P
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filledBlack Housing, Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating, with Plastic Pegs,

File Size 355.99K  /  5 Page

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Amphenol Communications Solutions

Part No. 77311-118-23LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0430451823

Molex Electronics Ltd.
Part No. 0430451823
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 18 Circuits

File Size 183.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137926-1823LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Gold Flash plating, Natural Color, 18 Positions, GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

    CDP1823C CDP1823CD3 CDP1823C_3

INTERSIL[Intersil Corporation]
Part No. CDP1823C CDP1823CD3 CDP1823C_3
Description High-Reliability CMOS 128-Word x 8-Bit Static RAM

File Size 27.32K  /  6 Page

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Amphenol Communications Solutions

Part No. 71918-230LF
Description Quickie Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, 30 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0873401823

Molex Electronics Ltd.
Part No. 0873401823
Description 2.00mm (.079") Pitch Milli-Grid Receptacle, Surface Mount (Very Low Profile), Top Entry

File Size 265.28K  /  5 Page

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Amphenol Communications Solutions

Part No. 77315-418-23LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 23 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    TE Connectivity Ltd
Part No. 0-519024-2 0-539787-9 411-18239 0-744003-9
Description    This ERGOCRIMP Die is suitable to crimp the following crimp contacts

File Size 94.61K  /  11 Page

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Amphenol Communications Solutions

Part No. 77311-518-23LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    TE Connectivity Ltd
Part No. 0-0519024-2 0-519151-9 411-18237 0-744003-7
Description For further information, not included in this IS , and for technical assistance please contact
   For further information, not included in this IS , and for technical assistance please contact

File Size 94.06K  /  11 Page

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Amphenol Communications Solutions

Part No. 68418-236HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For MSRX-1823 Found Datasheets File :: 134+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |   

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