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  44067-0802 Datasheet PDF File

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    0440672002 44067-2002

Molex Electronics Ltd.
Part No. 0440672002 44067-2002
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector
File Size 204.10K  /  3 Page

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Amphenol Communications Solutions
Part No. G832MC110802022HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash Black.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0440672001 44067-2001

Molex Electronics Ltd.
Part No. 0440672001 44067-2001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating
MOLEX Connector
File Size 204.09K  /  3 Page

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Amphenol Communications Solutions
Part No. 10119109-508022LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    SCT-0803 SCT-080X SCT-0802

MICRO-ELECTRONICS[Micro Electronics]
Part No. SCT-0803 SCT-080X SCT-0802
Description MINI-LAN SMD PCMCIA TRANSFORMER
File Size 387.88K  /  2 Page

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Amphenol Communications Solutions
Part No. 93689-108-02LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Press Fit, Single row , 2 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    44067-0801 SD-44067-001 0440670801

Molex Electronics Ltd.
Part No. 44067-0801 SD-44067-001 0440670801
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size 204.10K  /  3 Page

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Amphenol Communications Solutions
Part No. 51740-10802408CALF
Description PwrBlade®, Power Supply Connectors, 8P 24S 8P Vertical Receptacle.
Tech specs 　 　

Official Product Page

    0440672401 SD-44067-001 44067-2401

Molex Electronics Ltd.
Part No. 0440672401 SD-44067-001 44067-2401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
MOLEX Connector
File Size 204.11K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-108021200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    SD-44067-001 44067-1803 0440671803

Molex Electronics Ltd.
Part No. SD-44067-001 44067-1803 0440671803
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header
3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 55508-026TRLF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Double row, 26 Positions, 2mm (0.079inch), Vertical.
Tech specs 　 　

Official Product Page

    44067-0602 SD-44067-001 0440670602

Molex Electronics Ltd.
Part No. 44067-0602 SD-44067-001 0440670602
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 54101-G0802LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    0440671402 44067-1402 SD-44067-001

Molex Electronics Ltd.
Part No. 0440671402 44067-1402 SD-44067-001
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header
MOLEX Connector
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 54101-S0802LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    63444-0802

Molex Electronics Ltd.
Part No. 63444-0802
Description Punch
File Size 25.09K  /  1 Page

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Amphenol Communications Solutions
Part No. 54111-108021000LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-0802

Molex Electronics Ltd.
Part No. 43045-0802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 460-8025-063
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 5 Row HSD, 25 positions, open, adv mate, 4.25mm (0.167in), Header.
Tech specs 　 　

Official Product Page

For 44067-0802 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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