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  wire-in-air Datasheet PDF File

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    HD74CDCV857

HITACHI[Hitachi Semiconductor]
Part No. HD74CDCV857
OCR Text ...ing parameters. 4 Assumes equal wire length and loading on the clock output and feedback path. 5. Static phase error does not include jitter...in clock period, around anominal clock period. 8. Period jitter and half period jitter are independe...
Description 2.5-V Phase-lock Loop Clock Driver

File Size 60.37K  /  15 Page

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    IR2111

IRF[International Rectifier]
Part No. IR2111
OCR Text ...ethod of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness ...IN HO LO Figure 1. Input/Output Timing Diagram Figure 2. Floating Supply Voltage Transie...
Description    HALF-BRIDGE DRIVER

File Size 237.91K  /  7 Page

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    IR2125 HD74HC138

IRF[International Rectifier]
HITACHI
Part No. IR2125 HD74HC138
OCR Text ...ethod of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness ...IN CS 50V/ns ERR 4 HO Figure 1. Input/Output Timing Diagram Figure 2. Floating Supply Volt...
Description 3-to-8-line Decoder/Demultiplexer
CURRENT LIMITING SINGLE CHANNEL DRIVER

File Size 437.69K  /  16 Page

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    L4964 L4964HT

STMicroelectronics
Part No. L4964 L4964HT
OCR Text ...ICS 58930 - A2 MPP N turns : 43 Wire Gauge : 1 mm (18 AWG) 6/13 L4964 Figure 5 : PC. Board and Component Layout of the Circuit of Fig...in this publication are subject to change without notice. This publication supersedes and replaces a...
Description HIGH CURRENT SWITCHING REGULATOR

File Size 206.60K  /  13 Page

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    UMA1020AM UMA1020

PHILIPS[Philips Semiconductors]
Part No. UMA1020AM UMA1020
OCR Text ...der ratios are supplied via a 3-wire serial programming bus. Separate power and ground pins are provided to the analog and digital circuits....in-lock detect output (main PLL); test mode output UMA1020AM Fig.2 Pin configuration. FUNCT...
Description Low-voltage dual frequency synthesizer for radio telephones

File Size 152.20K  /  20 Page

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    ICS843023 ICS843023AG ICS843023AGT

ICST[Integrated Circuit Systems]
Part No. ICS843023 ICS843023AG ICS843023AGT
OCR Text ...ure at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction tempe...in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropr...
Description 3.3V, 250MHZ LVPECL CLOCK GENERATOR

File Size 167.19K  /  10 Page

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    ICS843031 ICS843031AG ICS843031AGT

PHOENIX CONTACT Deutschland GmbH
ICST[Integrated Circuit Systems]
Part No. ICS843031 ICS843031AG ICS843031AGT
OCR Text ...ure at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction tempe...in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropr...
Description CABLE ASSEMBLY; BANANA PLUG TO BANANA PLUG; 50 OHM, RG316/U COAX; 72" CABLE LENGTH FEMTOCLOCKS⑩晶体至3.3V的LVPECL时钟发生
FEMTOCLOCKS⑩ CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
FEMTOCLOCKS CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR

File Size 200.89K  /  11 Page

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    IR2101

IRF[International Rectifier]
Part No. IR2101
OCR Text ...ethod of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness Package Remarks: Method Material Material Die Area Lead Plating Types Mater...
Description HIGH AND LOW SIDE DRIVER

File Size 357.98K  /  6 Page

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    IR2112

International Rectifier
Part No. IR2112
OCR Text ...ethod of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness Package Remarks: Method Material Material Die Area Lead Plating Types Mater...
Description HIGH AND LOW SIDE DRIVER

File Size 379.67K  /  14 Page

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