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wire-bond Datasheet PDF File

For wire-bond Found Datasheets File :: 3487 Search Time::2.515ms
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				Hittite Microwave Corporati...
Part No.	HMC425
OCR Text	...ible in order to minimize bond wire length. typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). handling precautions follow these precautions to avoid permanent damage. storage: all bare die are placed in either waff...
Description	0.5 dB LSB GaAs MMIC 6-BIT DIGITAL POSITIVE CONTROL ATTENUATOR, 2.4 - 8.0 GHz
File Size	243.75K / 6 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. Motorola, Inc. MOTOROLA[Motorola Inc] MOTOROLA[Motorola, Inc]
Part No.	MPX2200 MPX2200A MPX2200AP MPX2200AS MPX2200D MPX2200DP MPX2200GP MPX2200GS MPX2200GVP MPX2200GVS MPX2201DP MPX2201GP MPX2201
OCR Text	...ential SILICONE GEL DIE COAT WIRE BOND WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates an absolute sensing die (right) and...
Description	0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) 000千帕29 PSI）的全尺寸为40 mV跨度（典型） 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) 000千帕9 PSI）的全尺寸为40 mV跨度（典型） (MPX2200 / MPX2201) 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL)
File Size	169.29K / 8 Page	View it Online	Download Datasheet

				Raytheon
Part No.	RMWP38001
OCR Text	...ding straps. all die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device. recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short ...
Description	37-40 GHz power amplifier MMIC
File Size	311.25K / 6 Page	View it Online	Download Datasheet

				Raytheon RF Components
Part No.	RMWL05001
OCR Text	...ding straps. all die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device. recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short ...
Description	5 GHZ Low Noise Amplifier Mmic
File Size	440.71K / 6 Page	View it Online	Download Datasheet

				Raytheon
Part No.	RMWL05001
OCR Text	...ding straps. all die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device. recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short ...
Description	5 GHz low noise amplifier MMIC
File Size	407.26K / 6 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MPX5100 MPX5100A MPX5100AP MPX5100D MPX5100DP MPX5100GP MPX5100GSX MPXV5100GC7U MPXV5100 MPXV5100GC6U
OCR Text	...el isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphrag...BOND STAINLESS STEEL METAL COVER FLUORO SILICONE GEL DIE COAT STAINLESS STEEL METAL COVER EPOXY PLAS...
Description	MPX5100 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
File Size	394.62K / 12 Page	View it Online	Download Datasheet

				Motorola, Inc. MOTOROLA[Motorola, Inc]
Part No.	MPX7100 MPX7100A MPX7100AP MPX7100AS MPX7100ASX MPX7100D MPX7100DP MPX7100GP MPX7100GS MPX7100GSX MPX7100GVP MPX7100GVS MPX7100GVSX
OCR Text	...ential SILICONE GEL DIE COAT WIRE BOND WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration ...
Description	0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)
File Size	190.50K / 10 Page	View it Online	Download Datasheet

For wire-bond Found Datasheets File :: 3487 Search Time::2.515ms
Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |