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  SDTR1503-0736 Datasheet PDF File

For SDTR1503-0736 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0736430100 73643-0100

Molex Electronics Ltd.
Part No. 0736430100 73643-0100
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, Press-Fit,End Wall Option, 72 Circuits
File Size 144.02K  /  4 Page

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Amphenol Communications Solutions
Part No. 54121-107361150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0736423209 73642-3209

Molex Electronics Ltd.
Part No. 0736423209 73642-3209
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, Press-Fit, Open End, 144 Circuits
File Size 151.02K  /  4 Page

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Amphenol Communications Solutions
Part No. 54112-807361000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0736423200 73642-3200

Molex Electronics Ltd.
Part No. 0736423200 73642-3200
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, Press-Fit,Open End, 144 Circuits
File Size 151.39K  /  4 Page

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Amphenol Communications Solutions
Part No. 77315-807-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    73644-1003 0736441003

Molex Electronics Ltd.
Part No. 73644-1003 0736441003
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position B, 144 Circuits
File Size 167.28K  /  4 Page

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Amphenol Communications Solutions
Part No. 54121-107360800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    73644-1002 0736441002

Molex Electronics Ltd.
Part No. 73644-1002 0736441002
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 144 Circuits
File Size 167.28K  /  4 Page

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Amphenol Communications Solutions
Part No. 54122-807361150LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 36 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    73644-1001 0736441001

Molex Electronics Ltd.
Part No. 73644-1001 0736441001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
File Size 167.84K  /  4 Page

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Amphenol Communications Solutions
Part No. 75168-307-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    73644-1000 0736441000

Molex Electronics Ltd.
Part No. 73644-1000 0736441000
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits
File Size 167.84K  /  4 Page

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Amphenol Communications Solutions
Part No. 54121-107360950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0736440001 73644-0001

Molex Electronics Ltd.
Part No. 0736440001 73644-0001
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press
File Size 167.33K  /  4 Page

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Amphenol Communications Solutions
Part No. 75160-107-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    73642-3000 0736423000

Molex Electronics Ltd.
Part No. 73642-3000 0736423000
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, Press-FitOpen End, 144 Circuits
File Size 151.39K  /  4 Page

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Amphenol Communications Solutions
Part No. 54121-407360940LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    WESTCODE SEMICONDUCTORS LTD
Part No. M0736LC450
Description 736 A, 4500 V, SILICON, RECTIFIER DIODE
File Size 586.17K  /  11 Page

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Amphenol Communications Solutions
Part No. 75168-107-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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