| |
|
 |
23
22
20
MICROPAC[Micropac Industries]
Micropac Industries, Inc.
|
| Part No. |
61063-101 61063 61063-001
|
| Description |
PHOTODIODE “PILL pack?/a>
PHOTODIODE PILL pack
Micropac Industries
PHOTODIODE “PILL pack”
PHOTODIODE B>PILL pack
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; Number of Contacts:3; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight PHOTO DIODE
PHOTODIODE PILL pack 光电二极管“丸包装
|
| File Size |
75.29K /
2 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Intel, Corp.
|
| Part No. |
PUMA2S16000M-025 PUMA77S16000M-020 PUMA2S16000I-025 PUMA77S16000AI-35 PUMA77S16000I-025 PUMA77S16000MB-025 PUMA2S16000MB-025 PUMA77S16000-020 PUMA77S16000AMB-020 PUMA77S16000AI-020 PUMA77S16000AM-025
|
| Description |
15NS, 68 plcc, IND TEMP(EPLD)
SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
15NS, 68 plcc, COM TEMP(EPLD)
SRAM|512KX32|CMOS|QFP|68PIN|CERAMIC
20NS, 44 plcc, IND TEMP(EPLD)
30MHZ, 20 plcc, IND TEMP, GREEN(FPGA)
15NS, TQFP, COM TEMP, ROHS-A(EPLD)
20NS, 44 TQFP, COM TEMP(EPLD)
7NS, 44 TQFP, COM TEMP, GREEN(EPLD)
30MHZ, 3.3V, 20 plcc, IND TEMP(FPGA) 静态存储器| 512KX32 |的CMOS |美巡赛| 66PIN |陶瓷
|
| File Size |
196.28K /
10 Page |
View
it Online |
Download Datasheet |
| |
|
|
Semiconductor Technology, Inc.
|
| Part No. |
2N6836 ST535 ST555 ST556 2N6835 ST554 FT401
|
| Description |
TRANSISTOR | BJT | NPN | 400V V(BR)CEO | 2A I(C) | TO-3
NPN & PNP High Voltage Silicon High Power Transistors
Programmable Logic IC; Logic Type:Programmable; No. of Macrocells:64; package/Case:44-plcc; Mounting Type:Surface Mount
IC CONFIG DEVICE 212KBIT 20-plcc
TRANSISTOR | BJT | NPN | 450V V(BR)CEO | 8A I(C) | TO-204AC
IC CONFIG DEVICE 1MBIT 20-plcc
|
| File Size |
153.59K /
1 Page |
View
it Online |
Download Datasheet |
| |
|
|
ADVANCED MICRO DEVICES INC
|
| Part No. |
AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT-80DPI2 AM29LV800BT-80DWC2 AM29LV800BT-80DWI2 AM29LV800BT-80DGC2 AM29LV800BT-80DTI2 AM29LV800BT-80DPC2 AM29LV800BB-80DGI2 AM29LV800BB-80DPI2 AM29LV800BB-80DTI2 AM29LV800BB-80DWC2 AM29LV800BB-80DWI2 AM29LV800BB-80DPC2 AM29LV800BB-80DGC2 AM29LV800BB-80DTC2 AM29LV800BB-120DTC2 AM29LV800BT-90DPI2 AM29LV800BT-90DTI2 AM29LV800BT-90DWI2 AM29LV800BT-120DTI2 AM29LV800BB-120DTI2 AM29LV800BT-120DGI2 AM29LV800BT-120DTC2 AM29LV800BB-90DTI2 AM29LV800BB-90DGC2 AM29LV800BB-120DGC2 AM29LV800BT-120DPC2 AM29LV800BT-90DPC2 AM29LV800BT-120DWI2 AM29LV800BB-120DPC2 AM29LV800BB-90DPC2 AM29LV800BB-90DWI2
|
| Description |
25NS,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD)
20NS, OTP, plcc, COM TEMP(EPLD)
20NS, SOIC, IND TEMP(EPLD)
25NS, SOIC, COM TEMP(EPLD)
20NS,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD)
10MHZ, 8 DIP, COM TEMP(FPGA)
10MHZ, 20 plcc, IND TEMP(FPGA)
10MHZ, 32 TQFP, COM TEMP(FPGA)
10MHZ, 44 plcc, COM TEMP(FPGA)
30MHZ, 3.3V, 20 plcc, COM TEMP(FPGA)
8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE)
DIE SALE, 1.8V, 11 MIL(SERIAL EE)
8 PDIP,PB/HALO FREE,IND TEMP,1.8V(SERIAL EE)
65K CONFIG MEM, 20 plcc, IND TEMP(FPGA)
10MHZ, 20 SOIC, IND TEMP(FPGA)
128K CONFIG MEM, 20 plcc, COM(FPGA)
EEPROM EEPROM
10MHZ, 8 NSOIC, COM TEMP(FPGA) EEPROM
512K X 16 FLASH 3V PROM, 120 ns, UUC44
10MHZ, 8 LAP, 5K MOQ(FPGA)
10MHZ, 8 N-SOIC, COM TEMP(FPGA)
10MHZ, 20 plcc, COM TEMP(FPGA)
512K X 16 FLASH 3V PROM, 80 ns, UUC44
|
| File Size |
127.66K /
11 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
