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moly Datasheet PDF File

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				Hittite Microwave Corporation
Part No.	HMC578
OCR Text	...thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize ribbon bond length. Typical die-to-substrate spaci...
Description	GAAS MMIC X2 ACTIVE FREQUENCY MULTIPLIER, 24 - 33 GHZ OUTPUT
File Size	242.95K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC570
OCR Text	...thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing...
Description	GaAs MMIC I/Q DOWNCONVERTER 17 - 21 GHz
File Size	305.56K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC451
OCR Text	...thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing...
Description	GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 5.0 - 20.0 GHz
File Size	343.24K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC516
OCR Text	...thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 7 - 17 GHz
File Size	289.37K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC517
OCR Text	...thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 17 - 26 GHz
File Size	286.67K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC518
OCR Text	...thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz
File Size	291.06K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC519
OCR Text	...thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 18 - 32 GHz
File Size	306.71K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC520
OCR Text	...thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing...
Description	GaAs MMIC I/Q MIXER 6 - 10 GHz
File Size	282.91K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC521
OCR Text	...thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing...
Description	GaAs MMIC I/Q MIXER 8.5 - 13.5 GHz
File Size	280.40K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC522
OCR Text	...thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing...
Description	GaAs MMIC I/Q MIXER 11 - 16 GHz
File Size	277.61K / 6 Page	View it Online	Download Datasheet

For moly Found Datasheets File :: 583 Search Time::1.329ms
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