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  die cell Datasheet PDF File

For die cell Found Datasheets File :: 3088    Search Time::2.25ms    
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    CY14E256LA-SZ45XIT CY14E256LA-SZ25XIT

Cypress Semiconductor
Part No. CY14E256LA-SZ45XIT CY14E256LA-SZ25XIT
OCR Text ...his pin is not connected to the die. Notes 1. Address expansion for 1 Mbit. NC pin not connected to die. 2. Address expansion for 2 Mbit....cell. They are an SRAM memory cell and a nonvolatile QuantumTrap cell. The SRAM memory cell operates...
Description 256-Kbit (32 K × 8) Nonvolatile SRAM

File Size 592.86K  /  19 Page

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    QuickLogic Corp.
Part No. QL3004
OCR Text ...n-volatile cmos process small die sizes - first fpga family to use staggered pads advanced i/o capabilities multi-volt compatible i/os f...cell can implement one large function, five independent smaller func- tions, or any combination in-...
Description pASIC 3 FPGA Family High Performance and High Density with Low Cost and Complete Flexibiltiy(具有低成本和充分灵活性的高性能和高密度的pASIC 3现场可编程门阵列)

File Size 236.66K  /  10 Page

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    Electronic Theatre Controls, Inc.
Hanbit Electronics Co., Ltd.
Part No. IBM0325404CT3A-75A IBM03254B4CT3A-75A IBM0325804CT3A-75A IBM0325404CT3A-260 IBM0325804CT3A-260 IBM03254B4CT3A-260 IBM0325164CT3A-360 IBM0325804CT3A-360 IBM03254B4CT3A-10
OCR Text die revision a 29l0000.e36980a 7/99 ?ibm corporation. all rights reserved. use is further subject to the provisions at the end of this docum...cell array row decoder address buffers (15) column decoder sense amplifiers memory bank d cell array...
Description x16 SDRAM
x8 SDRAM x8 SDRAM内存
x4 SDRAM Module x4内存模块

File Size 698.47K  /  68 Page

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    CY14B256LA-SZ45XIT CY14B256LA-SP25XIT CY14B256LA-SP45XIT CY14B256LA-SZ25XIT CY14B256LA-ZS25XI CY14B256LA-ZS25XIT

Cypress Semiconductor
Part No. CY14B256LA-SZ45XIT CY14B256LA-SP25XIT CY14B256LA-SP45XIT CY14B256LA-SZ25XIT CY14B256LA-ZS25XI CY14B256LA-ZS25XIT
OCR Text ...1 Mbit. NC pin not connected to die. 2. Address expansion for 2 Mbit. NC pin not connected to die. 3. Address expansion for 4 Mbit. NC pin n...cell. They are an SRAM memory cell and a nonvolatile QuantumTrap cell. The SRAM memory cell operates...
Description 256-Kbit (32 K × 8) nvSRAM

File Size 647.94K  /  22 Page

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    Advanced Micro Devices, Inc.
ADVANCED MICRO DEVICES INC
Part No. AM29LV800BT90SCB AM29LV800BB70FIB
OCR Text ...pin tsop 44-pin so known good die (kgd) (see publication number 21536) n compatibility with jedec standards pinout and software compatibl...cell margin. the unlock bypass mode facili- tates faster programming times by requiring only two w...
Description 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory 512K X 16 FLASH 3V PROM, 90 ns, PDSO44
512K X 16 FLASH 3V PROM, 70 ns, PDSO48

File Size 752.63K  /  44 Page

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    MCP73213 MCP73213-A6SI_MF MCP73213-B6SI_MF MCP73213-I_MF MCP73213T MCP73213T-A6SI_MF MCP73213T-B6SI_MF MCP73213T-I_MF MC

Microchip Technology
Part No. MCP73213 MCP73213-A6SI_MF MCP73213-B6SI_MF MCP73213-I_MF MCP73213T MCP73213T-A6SI_MF MCP73213T-B6SI_MF MCP73213T-I_MF MCP73213T-I/MF MCP73213T-B6SI/MF MCP73213-B6SI/MF MCP73213-I/MF MCP73213T-A6SI/MF
OCR Text ...its the charge current based on die temperature during high power or high ambient conditions. This thermal regulation optimizes the charge c...cell Li-Ion/Li-Poly Chargers / Cradles * Includes Exposed Thermal Pad (EP); see Table 3-1. (c)...
Description Dual-cell Li-Ion / Li-Polymer Battery Charge Management Controller with Input Overvoltage Protection

File Size 387.62K  /  34 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F6408U0A-TCB0
OCR Text ...g or programming. item before(m-die) after(a-die) program time 1,000us(max.) 500us(max.) number of partial program in the same page 10 cycl...cell to register (tr) 7us(max.) 10us(max.) draft date april 10th 1999 july 23th 1999 sep. 15th 1999 ...
Description TV 32C 32#20 SKT RECP 8米8位NAND闪存

File Size 350.56K  /  26 Page

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    H5MS2562JFR-E3M H5MS2562JFR-J3M H5MS2562JFR-K3M H5MS2562JFR-L3M

Hynix Semiconductor
Part No. H5MS2562JFR-E3M H5MS2562JFR-J3M H5MS2562JFR-K3M H5MS2562JFR-L3M
OCR Text ...NFORMATION for Hynix KNOWN GOOD die With the advent of Multi-Chip package (MCP), Package on Package (PoP) and System in a Package (SiP) app...cell Array 32 16 DQ15 Column decoders Bank Select Column Add Counter LDQS ~ UDQ...
Description 256Mb (16Mx16bit) Mobile DDR SDRAM

File Size 1,318.70K  /  62 Page

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    ISL9222IRTZ-T ISL9222

Intersil Corporation
Part No. ISL9222IRTZ-T ISL9222
OCR Text ...aterial sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant a...cell voltage rises to 4.2V. When the battery voltage reaches 4.2V, the charger enters a CV mode and ...
Description High Input Voltage Charger

File Size 113.25K  /  8 Page

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    AM29F200

Advanced Micro Devices
Part No. AM29F200
OCR Text ...pin so 48-pin tsop known good die (kgd) (see publication number 21257) n compatible with jedec standards pinout and software compatible w...cell margin. device erasure occurs by executing the erase command sequence. this initiates the embe...
Description 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 5.0 Volt-only/ Boot Sector Flash Memory

File Size 253.31K  /  39 Page

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