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  90136-2304 Datasheet PDF File

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    90136-2104

Molex Electronics Ltd.
Part No. 90136-2104
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Toshiba Electronic Devices & Storage Corporation

Part No. TLP2304
Description Photocoupler (photo-IC output), High-speed / IPM driver, 1 Mbps, 3750 Vrms, 5pin SO6
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-2103

Molex Electronics Ltd.
Part No. 90136-2103
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

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    90136-2118

Molex Electronics Ltd.
Part No. 90136-2118
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.43K  /  5 Page

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    90136-1212

Molex Electronics Ltd.
Part No. 90136-1212
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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    90136-1210

Molex Electronics Ltd.
Part No. 90136-1210
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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    90136-2102

Molex Electronics Ltd.
Part No. 90136-2102
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

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    90136-2225

Molex Electronics Ltd.
Part No. 90136-2225
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 25 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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    90136-2210

Molex Electronics Ltd.
Part No. 90136-2210
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 254.60K  /  5 Page

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    Ecliptek, Corp.
Molex, Inc.
Part No. 90136-1109 90136-1107 90136-1304
Description Header; Number of Contacts:9; Pitch Spacing:2.54mm; Number of Rows:1; Series:C-Grid III; Connector Body Material:Polyester; Mounting Type:PC Board; Terminal Type:Straight Pin 9 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
Header; No. of Contacts:7; Pitch Spacing:2.54mm; No. of Rows:1; Series:C-Grid III; Connector Body Material:Polyester; Mounting Type:PC Board; Terminal Type:Straight Pin 7 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
C-Grid Shrd Hdr SR Vt Au-F 4Ckt 4 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 131.27K  /  2 Page

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    2304

GHz Technology
Part No. 2304
Description 4.0 Watts - 20 Volts, Class C Microwave 2300 MHz

File Size 214.30K  /  4 Page

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