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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
XPH13016MC
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| Description |
P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-879-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
86130162113365E1LF
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| Description |
8613 M LF CNR
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
70430-168LF
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| Description |
Metral® Power Connectors, Backplane Power Connectors, 5 Row Power Header,Vertical Press-Fit, Wide body.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
86130162113345E1LF
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| Description |
8613 M LF CNR
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51730-162LF
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| Description |
PwrBlade®, Power Supply Connectors, 2P 16S 2P Right Angle Header.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2815 0879142815
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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| File Size |
3,777.37K /
48 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
70430-163LF
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| Description |
Metral® Power Connectors, Backplane Power Connectors, 5 Row Power Header,Vertical Press-Fit, Wide body.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143416 87914-3416
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
86130161024345E1LF
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| Description |
8613 M CNR LF
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
70430-169LF
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| Description |
Metral® Power Connectors, Backplane Power Connectors, 5 Row Power Header,Vertical Press-Fit, Wide body.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143203 87914-3203
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
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| File Size |
759.86K /
11 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
91753-016TRLF
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| Description |
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Header, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch..
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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