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  87834-1011 Datasheet PDF File

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    87834-4411

Molex Electronics Ltd.
Part No. 87834-4411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded Lead-free, 44 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window
2.54mm (.100) Pitch C-Grid垄莽 Header, Dual Row, Low Profile, Vertical, Shrouded Lead-free, 44 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.58K  /  3 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Integrated Circuit Technology Corp
Part No. MZTK06N1011/KS35D
Description MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, 4-4mT, 200mA, RECTANGULAR

File Size 81.64K  /  1 Page

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Amphenol Communications Solutions

Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ITT, Corp.
Part No. MZCK03P1011/KS35D
Description MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, 4-4mT, 200mA, PA66

File Size 81.18K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs    

Official Product Page

    Molex, Inc.
MOLEX INC
Part No. 87834-3411 87834-1611
Description 2.54mm CGrid Hdr /Pg/Slt 1PdNiAuLF 34Ckt 34 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
16 WAY IDC HEADER

File Size 95.04K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    87834-4441 0878344441

Molex Electronics Ltd.
Part No. 87834-4441 0878344441
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13楼矛m (5楼矛) Gold (Au) Flash Plating

File Size 112.89K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0878343411 87834-3411

Molex Electronics Ltd.
Part No. 0878343411 87834-3411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 34 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    87834-2441 0878342441

Molex Electronics Ltd.
Part No. 87834-2441 0878342441
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 121.31K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    0878341021

Molex Electronics Ltd.
Part No. 0878341021
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    87834-0411 0878340411

Molex Electronics Ltd.
Part No. 87834-0411 0878340411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 4 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs    

Official Product Page

    0878340419 87834-0419

Molex Electronics Ltd.
Part No. 0878340419 87834-0419
Description 2.54mm Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded 4 Circuits, 0.13μm Gold (Au) Plating, Black, without PCBLocator, without End

File Size 115.08K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

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