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  87832-0408 Datasheet PDF File

For 87832-0408 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87832-4020

Molex Electronics Ltd.
Part No. 87832-4020
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 40 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.54K  /  6 Page

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Amphenol Communications Solutions

Part No. 77317-804-08LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 8 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87832-7222

Molex Electronics Ltd.
Part No. 87832-7222
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 46 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Pick-and-Place Cap

File Size 367.50K  /  6 Page

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Amphenol Communications Solutions

Part No. 57102-F04-08LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions
Tech specs    

Official Product Page

    87832-0634

Molex Electronics Ltd.
Part No. 87832-0634
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Center Polarization Slot

File Size 110.67K  /  3 Page

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Amphenol Communications Solutions

Part No. 69190-408HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 08 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-4622

Molex Electronics Ltd.
Part No. 87832-4622
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 46 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.88K  /  6 Page

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Amphenol Communications Solutions

Part No. 54242-804081000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-0411

Molex Electronics Ltd.
Part No. 87832-0411
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 4 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Locking Window

File Size 212.38K  /  4 Page

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Amphenol Communications Solutions

Part No. 68000-408-130050LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    87832-0606

Molex Electronics Ltd.
Part No. 87832-0606
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Window

File Size 215.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 68020-408-061033LF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-0608

Molex Electronics Ltd.
Part No. 87832-0608
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Window

File Size 215.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 54111-106040850LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-0609

Molex Electronics Ltd.
Part No. 87832-0609
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Locking Window

File Size 212.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 98426-F04-08-123LF
Description Minitek® 2.00mm, Wire to Board Connector, Shrouded Stacking Header - Through Hole - Double row - 16 Positions - 2mm (0.079inch) Pitch- Vertical.
Tech specs    

Official Product Page

    87832-4012

Molex Electronics Ltd.
Part No. 87832-4012
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 40 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 345.42K  /  5 Page

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Amphenol Communications Solutions

Part No. 54121-106040850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-2620

Molex Electronics Ltd.
Part No. 87832-2620
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 26 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.52K  /  6 Page

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Amphenol Communications Solutions

Part No. 77319-804-08LF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 08 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

For 87832-0408 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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