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  79107-7054 Datasheet PDF File

For 79107-7054 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    70545-0052

Molex Electronics Ltd.
Part No. 70545-0052
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 18 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Platin

File Size 252.66K  /  5 Page

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Amphenol Communications Solutions

Part No. 10128479-107500ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, Hermaphroditic, Vertical, Press-Fit, 2 Pair, 13 Column, 104 Position, 7.50mm Stack Height, 2.00mm (0.079in) Column Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70543-0014

Molex Electronics Ltd.
Part No. 70543-0014
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 15Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 10136647-054232LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Black Color, 5 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs    

Official Product Page

    70545-0053

Molex Electronics Ltd.
Part No. 70545-0053
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 19 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Platin

File Size 252.54K  /  5 Page

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Amphenol Communications Solutions

Part No. 10136647-054132LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Natural Color, 5 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs    

Official Product Page

    70545-0049

Molex Electronics Ltd.
Part No. 70545-0049
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 15 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Platin

File Size 252.66K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0022

Molex Electronics Ltd.
Part No. 70545-0022
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 23 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 23 Circuits, Tin (Sn) Plating

File Size 252.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0015

Molex Electronics Ltd.
Part No. 70545-0015
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 16 Circuits, Tin (Sn) Plating

File Size 252.54K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-407HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 7 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0048

Molex Electronics Ltd.
Part No. 70545-0048
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 14 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Platin

File Size 252.66K  /  5 Page

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Amphenol Communications Solutions

Part No. 10124677-0542R11LF
Description DDR4 Memory Module Sockets, Storage and Server Connector, Vertical, Surface Mount, 288 Position, 0.85mm (0.033in) Pitch
Tech specs    

Official Product Page

    70545-0045

Molex Electronics Ltd.
Part No. 70545-0045
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 11 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Platin

File Size 252.66K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-417HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0044

Molex Electronics Ltd.
Part No. 70545-0044
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 10 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Platin

File Size 252.66K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-425HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0042

Molex Electronics Ltd.
Part No. 70545-0042
Description 2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 8 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating

File Size 252.67K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-420HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

For 79107-7054 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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