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Amphenol Communications Solutions |
Part No. |
10150526-1011HLF
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Description |
2.0MM WIRE TO BOARD HEADER
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
85261-001LF
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Description |
Din Accessory Locking Frame 3x16
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Tech specs |
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Official Product Page
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Molex, Inc.
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Part No. |
39880-0724 39880-0732 39880-0740 39880-0716
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Description |
398800724 24 A, MODULAR TERMINAL BLOCK, 2 ROWS, 2 DECKS DUAL LEVEL 5.08 32 ASY 4.0MM 2 WIRE BLCK 24 A, MODULAR TERMINAL BLOCK, 2 ROWS, 2 DECKS DUAL LEVEL 5.08 40 ASY 24 A, MODULAR TERMINAL BLOCK, 2 ROWS, 2 DECKS DUAL LEVEL 5.08 16 ASY 4.0MM 2 WIRE BLAC 24 A, MODULAR TERMINAL BLOCK, 2 ROWS, 2 DECKS
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File Size |
48.97K /
1 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
93690-407-16LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-807161500LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77315-807-16LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0526101271
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Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 12 CircuitsLead-free, High Barrier Packaging 1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 12 CircuitsLead-free, High Barrier Packaging
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File Size |
504.02K /
9 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54122-807161150LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
52610-1671 0526101671
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Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 16 CircuitsLead-free, High Barrier Packaging 1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 16 CircuitsLead-free, High Barrier Packaging
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File Size |
504.02K /
9 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
59132-F40-07-161LF
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Description |
Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
52610-1672 0526101672
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Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 16 Circuits, Lead-free, High Barrier Packaging 1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 16 Circuits, Lead-free, High Barrier Packaging
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File Size |
523.95K /
8 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
89007-168LF
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Description |
Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
52610-1771 0526101771
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Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 17 CircuitsLead-free, High Barrier Packaging 1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 17 CircuitsLead-free, High Barrier Packaging
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File Size |
504.02K /
9 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54122-807161100LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
52610-1772 0526101772
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Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 17 Circuits, Lead-free, High Barrier Packaging 1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 17 Circuits, Lead-free, High Barrier Packaging
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File Size |
523.95K /
8 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
59112-F40-07-166LF
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Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions.
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Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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