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Amphenol Communications Solutions |
| Part No. |
G832MC110802022HR
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| Description |
0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash Black.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10119109-508022LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93689-108-02LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Press Fit, Single row , 2 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51740-10802408CALF
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| Description |
PwrBlade®, Power Supply Connectors, 8P 24S 8P Vertical Receptacle.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-108021200LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
55508-026TRLF
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| Description |
Minitek®, Board to Board, Receptacle, Surface Mount, Double row, 26 Positions, 2mm (0.079inch), Vertical.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0440671403 44067-1403
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| Description |
3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
MOLEX Connector
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| File Size |
204.16K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54101-G0802LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54101-S0802LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54111-108021000LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
460-8025-063
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| Description |
VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 5 Row HSD, 25 positions, open, adv mate, 4.25mm (0.167in), Header.
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Official Product Page
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Bom2Buy.com
Price and Availability
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