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  43650-1121 Datasheet PDF File

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    43650-0328

Molex Electronics Ltd.
Part No. 43650-0328
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 3 Circuits
File Size 155.89K  /  3 Page

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Murata Manufacturing Co Ltd
Part No. MHM411-21
Description Ionizer Module, 100-120VAC-input, Negative Ion
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43650-0327

Molex Electronics Ltd.
Part No. 43650-0327
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 3 Circuits
File Size 155.85K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-112122500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43650-0717

Molex Electronics Ltd.
Part No. 43650-0717
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Glow Wire Compatible
File Size 153.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 91911-21121LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 21 Positions, 1.00mm ( 0.039in) Pitch.
Tech specs 　 　

Official Product Page

    43650-0813

Molex Electronics Ltd.
Part No. 43650-0813
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Right Angle, with Solder Tab, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating,Glow Wire Compatible
File Size 153.11K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-112142100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43650-0817

Molex Electronics Ltd.
Part No. 43650-0817
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg
File Size 153.96K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-112162500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43650-0810

Molex Electronics Ltd.
Part No. 43650-0810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Right Angle, with PCB Press-fit Metal Retention Clip, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 163.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-111121000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43650-0811

Molex Electronics Ltd.
Part No. 43650-0811
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Right Angle, with PCB Press-fit Metal Retention Clip, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 163.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-111121850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43650-0815

Molex Electronics Ltd.
Part No. 43650-0815
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 8 Circuits, Tin (Sn) Plating, Glow Wire Compatible
File Size 153.89K  /  3 Page

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Amphenol Communications Solutions
Part No. CEC001121112100
Description Double Density Cool Edge Cable 0.8mm,112 signal pins,32AWG high speed cable,RA VS RA,Cable length of 100mm
Tech specs 　 　

Official Product Page

    43650-0716

Molex Electronics Ltd.
Part No. 43650-0716
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB
File Size 153.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-107400900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43650-0826

Molex Electronics Ltd.
Part No. 43650-0826
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Solder Tab, 8 Circuits, 0.70um
File Size 171.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-110102000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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