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ADPOW[Advanced Power Technology]
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Part No. |
DRF1200
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OCR Text |
...0s. 3. For lead free use 96.5 % tin, 3% silver, and 0.5% copper. 4. Non-lead Free use 2% Silver, 62% Tin, 36% lead (sn62).
PCB
PCB
Thermal Compound
Figure 11, Top and Side View of a T3 device Heat Sink Surface: 1. The heat sink ... |
Description |
MOSFET Driver Hybrid
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File Size |
1,461.36K /
8 Page |
View
it Online |
Download Datasheet
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ADPOW[Advanced Power Technology]
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Part No. |
DRF100
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OCR Text |
...0s. 3. For lead free use 96.5 % tin, 3% silver, and 0.5% copper. 4. Non-lead Free use 2% Silver, 62% Tin, 36% lead (sn62).
Figure 24, Top and Side View of a T3 device Heat Sink Surface: 1. The heat sink surface should be smooth, free of ... |
Description |
High Speed MOSFET Driver
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File Size |
2,364.38K /
12 Page |
View
it Online |
Download Datasheet
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Price and Availability
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