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  SDTR1503-0736 Datasheet PDF File

For SDTR1503-0736 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    73656-0000 0736560000

Molex Electronics Ltd.
Part No. 73656-0000 0736560000
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76μm (30μ)

File Size 343.53K  /  6 Page

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Amphenol Communications Solutions

Part No. 54121-107361150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0736420000 73642-0000

Molex Electronics Ltd.
Part No. 0736420000 73642-0000
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, Press-Fit,Open End, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, Press-Fit,Open End, 72 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-807361000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736440000 73644-0000

Molex Electronics Ltd.
Part No. 0736440000 73644-0000
Description 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide
2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide

File Size 167.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-807-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0736440006

Molex Electronics Ltd.
Part No. 0736440006
Description 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location

File Size 166.79K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-107360800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736431100 73643-1100

Molex Electronics Ltd.
Part No. 0736431100 73643-1100
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, Press-Fit, End Wall Option, 144 Circuits

File Size 144.52K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-807361150LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 36 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    73644-2108 0736442108

Molex Electronics Ltd.
Part No. 73644-2108 0736442108
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position D, 72 Circuits

File Size 174.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 75168-307-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736441013

Molex Electronics Ltd.
Part No. 0736441013
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position G, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-107360950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736432200 73643-2200

Molex Electronics Ltd.
Part No. 0736432200 73643-2200
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, Press-Fit,Closed End, 72 Circuits

File Size 159.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 75160-107-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs    

Official Product Page

    0736440004 73644-0004

Molex Electronics Ltd.
Part No. 0736440004 73644-0004
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 72 Circuits

File Size 166.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-407360940LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736440002 73644-0002

Molex Electronics Ltd.
Part No. 0736440002 73644-0002
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 72 Circuits

File Size 166.79K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 75168-107-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For SDTR1503-0736 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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