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material-copper Datasheet PDF File

For material-copper Found Datasheets File :: 25830 Search Time::1.704ms
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				SONY[Sony Corporation]
Part No.	CXA1684M
OCR Text	...M PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SOP-8P-L03 SOP008-P-0225 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER/PALLADIUM PLATING 42/COPPER ALLOY 0.1g NOTE : PALLADIUM PLATING This product us...
Description	High-Speed Transimpedance Amplifier
File Size	93.82K / 6 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXA1685M
OCR Text	...M PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SOP-8P-L03 SOP008-P-0225 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER/PALLADIUM PLATING 42/COPPER ALLOY 0.1g NOTE : PALLADIUM PLATING This product us...
Description	High-Speed Transimpedance Amplifier
File Size	105.29K / 8 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXA1994 CXA1994AM CXA1994BM CXA1994AM/BM
OCR Text	...M PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SOP-8P-L03 SOP008-P-0225 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER/PALLADIUM PLATING 42/COPPER ALLOY 0.1g NOTE : PALLADIUM PLATING This product us...
Description	M-ary FSK Demodulating Comparator M-ary FSK Demodulating Comparator Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C
File Size	118.20K / 8 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXA2566M
OCR Text	...M PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE PACKAGE MASS SOP-16P-L01 SOP016-P-0300 LEAD MATERIAL COPPER ALLOY 0.2g LEAD TREATMENT EPOXY RESIN SOLDER PLATING - 12 - 0.5 0.2 1 8 6.9
Description	Headphone Stereos
File Size	151.96K / 12 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL1503M CXL1505M
OCR Text	...P024-P-0300 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 0.3g -9- 0.5 0.2 1 0.45 0.1 12 6.9 + 0.1 0.2 - 0.05 1.27
Description	CMOS-CCD Signal Processor
File Size	178.07K / 9 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL1504M
OCR Text	...M PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SOP-20P-L01 SOP020-P-0300 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.3g -9- 0.5 0.2 1 0.45 0.1 10 6.9 + 0.1 0...
Description	CMOS-CCD 1H Delay Line for NTSC
File Size	111.86K / 9 Page	View it Online	Download Datasheet

				Sony, Corp. SONY[Sony Corporation]
Part No.	CXL5504M CXL5504P
OCR Text	...M PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SOP-8P-L01 SOP008-P-0300 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 0.1g 8PIN SOP (PLASTIC) 6.2 0.3 8 5 S 0.15 S ...
Description	CMOS-CCD 1H Delay Line for NTSC CMOS与CCD延迟线上半年对NTSC
File Size	133.95K / 11 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL5505M CXL5505P
OCR Text	...M PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SOP-14P-L01 SOP014-P-0300 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 0.2g CXL5505P 14PIN DIP (PLASTIC) + 0.4 19.2 - 0.1 ...
Description	CMOS-CCD 1H Delay Line for PAL
File Size	124.17K / 9 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL5506M CXL5506P
OCR Text	...M PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SOP-8P-L01 SOP008-P-0300 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 0.1g CXL5506P 8PIN DIP (PLASTIC) 8 5 7.62 ...
Description	CMOS-CCD 1H Delay Line for PAL
File Size	106.48K / 9 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL5507M CXL5507P
OCR Text	...M PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SOP-8P-L01 SOP008-P-0300 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 0.1g CXL5507P 8PIN DIP (PLASTIC) 8 5 7.62 ...
Description	CMOS-CCD 1H Delay Line for NTSC
File Size	103.73K / 9 Page	View it Online	Download Datasheet

For material-copper Found Datasheets File :: 25830 Search Time::1.704ms
Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |