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  h-die Datasheet PDF File

For h-die Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

   
Part No. AM29PL141LC AM29PL141/LMC AM29LPL141DC AM29LPL141DCB AM29LPL141JC AM29LPL141LC AM29PL141/BXA AM29PL141/B3A AM29PL141DC
Description 8 ULTRA THIN MINI MAP PB/HALO FREE,NIPDA(SERIAL EE)
DIE SALE, 1.8V, 27 MIL(SERIAL EE)
CCFL / EEFL Ballast Controller IC; A IRS2552DPBF with Standard Packaging
User Programmable Special Function ASIC
600V Half Bridge Driver LED Buck Regulator in a 8-Lead Dip Package; A IRS2541 packaged in a Lead-Free 8-Lead DIP
200V Half Bridge Driver LED Buck Regulator in a 8-Pin SOIC Package; A IRS2540 packaged in a Lead-Free 8-Lead SOIC
10MS, DIE, 1.8V, 27 MILS THICKNESS(SERIAL EE)
DIE SALE. 1.8V, 27 MIL(SERIAL EE) 用户可编程ASIC的特殊功

File Size 700.20K  /  26 Page

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Part No. PUMA2U2000M-20 PUMA2U2000M-15 PUMA2U2000I-17 PUMA2U2000M-17 PUMA2U2000I-20 PUMA2U2000I-12 PUMA2U2000I-15 PUMA2U2000MB-20 PUMA2U2000MB-12 PUMA2U2000-17 PUMA2U2000MB-17 PUMA2U2000M-12 PUMA2U2000-15
Description 10MS, 5 SOT23, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE)
DIE SALE, 27 MIL, 1.8V(SERIAL EE)
10MS, 8 TSSOP, EXT TEMP, GREEN, 2.7V(SERIAL EE)
10 MS, DIE, COM TEMP, 2.7V, 27MM THICK(SERIAL EE)
DIE SALE, 1.8V, 27 MIL(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, DIE, 1.8V, 11 MILS THICKNESS(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, 2.7V(SERIAL EE)
10MS, DBGA2, IND TEMP, GREEN, 1.8V(SERIAL EE)

File Size 381.00K  /  8 Page

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    DIOTEC[Diotec Semiconductor]
Part No. MS125 MS80 MS250 MS380 MS40 MS500
Description Surface Mount Si-Bridge-Rectifiers Si-Br?kengleichrichter f? die Oberfl?henmontage
Surface Mount Si-Bridge-Rectifiers Si-Br?kengleichrichter f? die Oberfl溷henmontage

File Size 115.46K  /  2 Page

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    NXP Semiconductors N.V.
Part No. HTCICC6402FUG HTCICC6403FUG
Description HITAG RO64 Transponder IC
HTCICC64; HITAG RO64 transponder IC HTCICC6402FUG/AM<Uncased die|<<<1<Always Pb-free,;HTCICC6403FUG/AM<Uncased die|<<<1<Always Pb-free,;

File Size 156.44K  /  13 Page

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    Infineon
Part No. SIDC03D30SIC2SAWN SIDC03D30SIC2UNSAWN
Description Diodes - HV Chips - 300V, 10A die sawn
Diodes - HV Chips - 300V, 10A die unsawn

File Size 65.96K  /  4 Page

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    IC MICROSYSTEMS Sdn. Bhd.
Part No. X76F128HG-2.7 X76F128HE-2.7 X76F128HEG-2.7
Description 16K X 8 FLASH 2.7V PROM, UUC ROHS COMPLIANT, DIE
16K X 8 FLASH 2.7V PROM, UUC DIE

File Size 430.64K  /  16 Page

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    SENSITRON[Sensitron]
Part No. MURC1060
Description MURC1060 Ultrafast Silicon Die
MURC1060 Ultrafast Silicon Die

File Size 233.98K  /  3 Page

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    MURC520

Sensitron
Part No. MURC520
Description MURC520 Ultrafast Silicon Die
MURC520 Ultrafast Silicon Die

File Size 140.32K  /  3 Page

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    http://
Part No. MURC620
Description MURC620 Ultrafast Silicon Die
MURC620 Ultrafast Silicon Die

File Size 233.31K  /  3 Page

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Part No. PUMA2U4000-25 PUMA2U4000-20 PUMA2U4000-17
Description 10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE)
10MS, DIE, 1.8V, 11 MILS THICKNESS(SERIAL EE)
8 DBGA2, PB/HALO FREE, 1.8V(SERIAL EE)

File Size 759.14K  /  8 Page

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