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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC282
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| OCR Text |
...p along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
1
AMPLIFIERS DIE
Mounting
The chip is ... |
| Description |
GaAs MMIC LOW NOISE AMPLIFIER 36 - 40 GHz
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| File Size |
108.21K /
6 Page |
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it Online |
Download Datasheet
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Anadigics Inc
ANADIGICS[ANADIGICS, Inc]
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| Part No. |
ATA7550 ATA7550D1
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| OCR Text |
...ting. A soft silicon/rubber tip collet or pyramidal collet should be used for die mounting, although tweezers can be used with extreme care. Thermosonic ball bonding, at a stage temperature of 150 to 175C with 1 to 1.3 mil gold wire, is the... |
| Description |
The Anadigics ATA7550D1 is a high-speed 5V transimpedance amplifier (TIA) available in bare die form and manufactured using an InGaP ...
Transimpedance Amplifiers (TIAs)
5.0V 2.5Gb/s TIA
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| File Size |
215.04K /
12 Page |
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it Online |
Download Datasheet |
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Anadigics
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| Part No. |
ATA7601
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| OCR Text |
...lity. A soft silicon/rubber tip collet or pyramidal collet should be used for die mounting, although tweezers can be used with extreme care. Thermosonic ball bonding, at a stage temperature of 150 to 175C with 1 to 1.3 mil gold wire, is the... |
| Description |
Transimpedance Amplifiers (TIAs)
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| File Size |
211.95K /
12 Page |
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it Online |
Download Datasheet |
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美国讯泰微波有限公司上海代表
HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC363
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| OCR Text |
...p along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and c... |
| Description |
GaAs HBT MMIC DIVIDE-BY-8/ DC - 12.0 GHz
GaAs HBT MMIC DIVIDE-BY-8 DC - 12.0 GHz
GaAs HBT MMIC DIVIDE-BY-8, DC - 12.0 GHz
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| File Size |
186.29K /
6 Page |
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it Online |
Download Datasheet |
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Hittite Microwave Corpo...
HITTITE[Hittite Microwave Corporation]
美国讯泰微波有限公司上海代表
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| Part No. |
HMC361
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| OCR Text |
...p along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and c... |
| Description |
GaAs HBT MMIC DIVIDE-BY-2, DC - 11.0 GHz
From old datasheet system
Prescaler
600,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
GaAs HBT MMIC DIVIDE-BY-2/ DC - 11.0 GHz
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| File Size |
197.79K /
6 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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