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  87834-1011 Datasheet PDF File

For 87834-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87834-2641

Molex Electronics Ltd.
Part No. 87834-2641
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87834-2645

Molex Electronics Ltd.
Part No. 87834-2645
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 26 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-2695

Molex Electronics Ltd.
Part No. 87834-2695
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.34K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs    

Official Product Page

    87834-2619

Molex Electronics Ltd.
Part No. 87834-2619
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 26 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    87834-4143

Molex Electronics Ltd.
Part No. 87834-4143
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without PCB Locator

File Size 93.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 87834-3041
Description CGrid Hdr W/Pg/Slt 1PdNiAuLF 30Ckt 30 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 94.65K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    87834-1695

Molex Electronics Ltd.
Part No. 87834-1695
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.53K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    87834-2045

Molex Electronics Ltd.
Part No. 87834-2045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 20 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.86K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    87834-5095

Molex Electronics Ltd.
Part No. 87834-5095
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05渭m (2渭) Gold (Au) Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.25K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs    

Official Product Page

    87834-1611

Molex Electronics Ltd.
Part No. 87834-1611
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 16 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

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