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  87832-0807 Datasheet PDF File

For 87832-0807 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87832-5522

Molex Electronics Ltd.
Part No. 87832-5522
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree, 12 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Pick-and-Place Cap

File Size 367.66K  /  6 Page

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Amphenol Communications Solutions

Part No. 54201-G0807ALF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87832-0609

Molex Electronics Ltd.
Part No. 87832-0609
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Locking Window

File Size 212.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 54201-S0807LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-0608

Molex Electronics Ltd.
Part No. 87832-0608
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Window

File Size 215.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 54202-S0807PA06LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-6923

Molex Electronics Ltd.
Part No. 87832-6923
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 40 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Pick-and-Place Cap

File Size 386.24K  /  6 Page

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Amphenol Communications Solutions

Part No. G832MB010807022HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 15.7 mm, 80 Positions, Dual Row, BTB Vertical Receptacle SMT, Gold Flash Black.
Tech specs    

Official Product Page

    87832-4012

Molex Electronics Ltd.
Part No. 87832-4012
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 40 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 345.42K  /  5 Page

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Amphenol Communications Solutions

Part No. 54121-408071800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-2620

Molex Electronics Ltd.
Part No. 87832-2620
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 26 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.52K  /  6 Page

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Amphenol Communications Solutions

Part No. 57102-F08-07LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 14 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    87832-0606

Molex Electronics Ltd.
Part No. 87832-0606
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Window

File Size 215.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 54102-S0807B03LF
Description 54102-S0807B03LF-BERG 0.100 HEADER
Tech specs    

Official Product Page

    87832-2622

Molex Electronics Ltd.
Part No. 87832-2622
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 26 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap

File Size 367.61K  /  6 Page

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Amphenol Communications Solutions

Part No. 54202-T0807AB06LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-4620

Molex Electronics Ltd.
Part No. 87832-4620
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 46 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.53K  /  6 Page

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Amphenol Communications Solutions

Part No. 54202-T0807B03LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-3421

Molex Electronics Ltd.
Part No. 87832-3421
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 34 Circuits, 0.76μm (30μ) Gold (Au) Plating

File Size 386.31K  /  6 Page

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Amphenol Communications Solutions

Part No. 54102-S0807LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 14 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 87832-0807 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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