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  502382-1170 Datasheet PDF File

For 502382-1170 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    5023820370 SD-502382-001

Molex Electronics Ltd.
Part No. 5023820370 SD-502382-001
Description 1.25mm (.049") Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Vertical, 3 Circuits
1.25mm (.049) Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Vertical, 3 Circuits

File Size 402.17K  /  6 Page

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Amphenol Communications Solutions

Part No. 54121-110111700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 11 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Electronic Theatre Controls, Inc.
ETC[ETC]
Part No. M1170-1 M1170-1P
Description 32 PATTERN VISION PERSISTENCE

File Size 197.03K  /  4 Page

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Amphenol Communications Solutions

Part No. 68491-170HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. 450-1170 450-1171
Description
File Size 177.72K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-170-12LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    POLYFET[Polyfet RF Devices]
Part No. F1170
Description PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR

File Size 42.49K  /  2 Page

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Amphenol Communications Solutions

Part No. 75970-117-06LF
Description BERGSTIK-DEROG 12-ASS-100
Tech specs    

Official Product Page

   
Part No. 450-1170-GR 450-1171-GR
Description
File Size 67.01K  /  1 Page

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Amphenol Communications Solutions

Part No. 10027011-703HWLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Surface Mount, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATF-21170

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. ATF-21170
Description 0.5-6 GHz Low Noise Gallium Arsenide FET

File Size 41.90K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-170-01LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 01 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    INA-01170

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. INA-01170
Description Low Noise, Cascadable Silicon Bipolar MMIC Amplifier
Low Noise/ Cascadable Silicon Bipolar MMIC Amplifier

File Size 43.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 67117-025LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Right Angle, Through Hole, Double Row, 50 Position ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    53254-1170

Molex Electronics Ltd.
Part No. 53254-1170
Description 2.00mm (.079) Pitch Micro-Latch?/a> Wire-to-Board Header, Right Angle, Square Pin,Three-sided Shroud, Lead-free, 11 Circuits

File Size 135.36K  /  4 Page

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Amphenol Communications Solutions

Part No. 79821-170HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

Official Product Page

    69127-1170

Molex Electronics Ltd.
Part No. 69127-1170
Description This sensor is used to detect cable insertion and trigger termination

File Size 53.61K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-170-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

   
Part No. P1170.901T
Description SMT Drum Core Inductors (Shielded) - P1170 Series 核心鼓表面贴装电感器(屏蔽) - P1170系列

File Size 59.06K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-111701800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 70 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

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