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  44067-2001 Datasheet PDF File

For 44067-2001 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0440672403 44067-2403

Molex Electronics Ltd.
Part No. 0440672403 44067-2403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector
File Size 204.16K  /  3 Page

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Texas Instruments
Part No. 8102001CA
Description CMOS Low-Power Monostable/Astable Multivibrator 14-CDIP -55 to 125
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0440672402 44067-2402

Molex Electronics Ltd.
Part No. 0440672402 44067-2402
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector
File Size 204.16K  /  3 Page

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Texas Instruments
Part No. MSP430F2001TRSAR
Description 16-bit Ultra-Low-Power Microcontroller, 1kB Flash, 128B RAM, Comparator 16-QFN -40 to 105
Tech specs 　 　

Official Product Page

    0440672201 44067-2201

Molex Electronics Ltd.
Part No. 0440672201 44067-2201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
MOLEX Connector
File Size 204.11K  /  3 Page

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Texas Instruments
Part No. 5962-9322001QRA
Description Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    44067-1201 0440671201

Molex Electronics Ltd.
Part No. 44067-1201 0440671201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating
File Size 204.11K  /  3 Page

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Texas Instruments
Part No. 5962-8852001DA
Description Dual Positive-Edge-Triggered D-Type- Flip-Flops With Clear And Preset 14-CFP -55 to 125
Tech specs 　 　

Official Product Page

    44067-1202 0440671202

Molex Electronics Ltd.
Part No. 44067-1202 0440671202
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
File Size 204.16K  /  3 Page

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Texas Instruments
Part No. 8302001RA
Description Octal D-Type Transparent Latches with 3-state Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    44067-1203 0440671203

Molex Electronics Ltd.
Part No. 44067-1203 0440671203
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
File Size 204.16K  /  3 Page

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Texas Instruments
Part No. V62/08620-01XE
Description Enhanced Product Excaliber Low-Noise High-Speed Precision Operational Amplifier 8-SOIC -55 to 125
Tech specs 　 　

Official Product Page

    44067-0601 0440670601

Molex Electronics Ltd.
Part No. 44067-0601 0440670601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
File Size 204.10K  /  3 Page

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Texas Instruments
Part No. TPA2001D1PWRG4
Description 1-W Mono Class-D Audio Amplifier 16-TSSOP -40 to 85
Tech specs 　 　

Official Product Page

    44067-0802 0440670802

Molex Electronics Ltd.
Part No. 44067-0802 0440670802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
File Size 204.16K  /  3 Page

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Texas Instruments
Part No. XIO2001PNP
Description PCI Express (PCIe) to PCI bus translation bridge 128-HTQFP 0 to 70
Tech specs 　 　

Official Product Page

    44067-1601 0440671601

Molex Electronics Ltd.
Part No. 44067-1601 0440671601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size 204.11K  /  3 Page

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Texas Instruments
Part No. DS92001TLD/NOPB
Description 3.3V B/LVDS-BLVDS Buffer 8-WSON -40 to 85
Tech specs 　 　

Official Product Page

    0440671401 44067-1401

Molex Electronics Ltd.
Part No. 0440671401 44067-1401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
MOLEX Connector
File Size 204.10K  /  3 Page

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Texas Instruments
Part No. DS92001TMAX/NOPB
Description 3.3V B/LVDS-BLVDS Buffer 8-SOIC -40 to 85
Tech specs 　 　

Official Product Page

For 44067-2001 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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