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  43045-0827 Datasheet PDF File

For 43045-0827 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    43045-0420

Molex Electronics Ltd.
Part No. 43045-0420
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 4 Circuits

File Size 175.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    43045-0610

Molex Electronics Ltd.
Part No. 43045-0610
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 6 Circuits

File Size 180.50K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs    

Official Product Page

    43045-1814

Molex Electronics Ltd.
Part No. 43045-1814
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits

File Size 166.55K  /  3 Page

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Amphenol Communications Solutions

Part No. 10082724-001LF
Description HCI® Connector System, Power Supply Connectors, 7DC+24S+4DC Right Angle Receptacle.
Tech specs    

Official Product Page

    43045-1812

Molex Electronics Ltd.
Part No. 43045-1812
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits

File Size 166.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 54101-G0827LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    43045-1818

Molex Electronics Ltd.
Part No. 43045-1818
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits

File Size 175.78K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-825082750LF
Description BergStik, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking header, Through Hole, Double Row, 8 Positions.
Tech specs    

Official Product Page

    43045-1813

Molex Electronics Ltd.
Part No. 43045-1813
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits

File Size 166.55K  /  3 Page

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Amphenol Communications Solutions

Part No. 10082722-001LF
Description HCI® Connector System, Power Supply Connectors, 7DC+24S+4DC Right Angle Header.
Tech specs    

Official Product Page

    43045-1817

Molex Electronics Ltd.
Part No. 43045-1817
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits

File Size 174.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 61082-082702LF
Description 0.8MM B TO B REC ASSY
Tech specs    

Official Product Page

    43045-1815

Molex Electronics Ltd.
Part No. 43045-1815
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits

File Size 174.05K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-825082750LF
Description BergStik, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking header, Through Hole, Double Row, 8 Positions.
Tech specs    

Official Product Page

    43045-0410

Molex Electronics Ltd.
Part No. 43045-0410
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 4 Circuits

File Size 180.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-082702LF
Description BERGSTAK 0.8MM
Tech specs    

Official Product Page

    43045-1811

Molex Electronics Ltd.
Part No. 43045-1811
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits

File Size 180.51K  /  3 Page

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