3136.3 pdf Datasheet P3 Part Num --- IC-ON-LINE


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3136.3 Datasheet PDF File

For 3136.3 Found Datasheets File :: 80+ Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 |


Part No.	2SC2548 2SC3136
Description	TRANSISTOR \| BJT \| NPN \| 10V V(BR)CEO \| 30MA I(C) \| TO-92 TRANSISTOR \| BJT \| NPN \| 20V V(BR)CEO \| 50MA I(C) \| TO-92
File Size	46.29K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	69173-136HLF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					NTE[NTE Electronics]
Part No.	NTE3136 NTE3139 NTE3133 NTE3135 NTE3138
Description	Light Emitting Diode − 1.8mm
File Size	59.13K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	91911-31369LF
Description	Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 69 Positions, 1.00mm ( 0.039in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0533136065
Description	2.00mm (.079) Pitch Mi ll?/a> System Wire-to-Board Header, Dual Row, Vertical, Leadfree 60 Circuits
File Size	123.99K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-3614-11H
Description	Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0353631360
Description	2.00mm (.079) Pitch Sherlock?/a> Wire-to-Board Header, Right Angle, with PositiveLock, 13 Circuits, Lead-free
File Size	304.13K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-3618-21D
Description	Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	87831-3620 0878313620
Description	2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 36 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 36 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot
File Size	218.09K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-3614-11D
Description	Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	87831-3628 0878313628
Description	2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 36 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 36 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot
File Size	189.09K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-3618-11H
Description	Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	87831-3621 0878313621
Description	2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 36 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 36 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
File Size	218.01K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68023-136HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54mm Pitch, RightAngle, 3.42mm (0.135in) Mating, 7.75mm (0.305in) Tail.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	15-45-3136 0015453136
Description	2.54mm (.100) Pitch C-Grid? PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 36 Circuits
File Size	736.20K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-3616-11H
Description	Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs				Official Product Page

					OKI ELECTRIC INDUSTRY CO LTD
Part No.	MSC23136B-60DS12
Description	1M X 36 FAST PAGE DRAM MODULE, 60 ns, SMA72
File Size	194.79K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68693-136HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch..
Tech specs				Official Product Page

					STMICROELECTRONICS[STMicroelectronics]
Part No.	STP25N06 STP25N06FI 3136
Description	From old datasheet system N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR
File Size	205.97K / 10 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	86503-136HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs				Official Product Page

For 3136.3 Found Datasheets File :: 80+ Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 |

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