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List of Unclassifed Man...
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Part No. |
S5535
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OCR Text |
...buffered non-ecc ddr3 1600/1333/1066 support up to 32gb unbuffered ecc ddr3 1600/1333/1066 ? (1) pci-e gen.2 x1 slot (1) pci-e gen.2 x8 slots (w/ x4 link) (1) pci-e gen.3 x16 slot ? (5) sata ports running at 6.0 gb/... |
Description |
Entry single-socket for Embedded/Workstation Product
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File Size |
668.39K /
2 Page |
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Advantech Co., Ltd.
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Part No. |
ASMB-782G4-00A1E
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OCR Text |
...y dual channel ddr3 ecc/non-ecc 1066/1333/1600 mhz (1600 only supported by xeon e3 v2, core i3 3xxx and pentium g2xxx series processors) max. capacity 32 gb socket 4 x 240-pin dimm memory size 1 gb, 2 gb, 4 gb, 8 gb expansion slots pci 32-... |
Description |
LGA 1155 Intel? Xeon? E3 V2 ATX Server Board with 2 PCIe x16 slots (x8 link),2 PCIe x4, USB 3.0, PCIe Gen III, Quad LANs
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File Size |
1,134.87K /
2 Page |
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Samsung Electronic SAMSUNG[Samsung semiconductor]
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Part No. |
K4R881869D K4R571669D
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OCR Text |
... (RSL) technology permits up to 1066 MHz transfer rates while using conventional system and board design technologies. RDRAM devices are capable of sustained data transfers up to 0.938ns per two bytes (7.5ns per sixteen bytes). The architec... |
Description |
256/288Mbit RDRAM(D-die)
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File Size |
309.27K /
20 Page |
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it Online |
Download Datasheet
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Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
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Part No. |
MR18R326GAG0-CT9 MR18R326GAG0-CM8 MR18R326GAG0
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OCR Text |
... (RSL) technology permits up to 1066 MHz transfer rates while using conventional system and board design technologies. RDRAM devices are capable of sustained data transfers at 0.94 ns per two bytes (7.5ns per 16 bytes). The RDRAM architectu... |
Description |
(32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V 2Mx186个RIMM的模块基76Mb阿芯片,32秒银行,32K/32ms参考,.5V (32Mx18) 16pcs RIMM Module based on 576Mb A-die 32s banks32K/32ms Ref 2.5V
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File Size |
256.70K /
14 Page |
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it Online |
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Price and Availability
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