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Mitsumi Electronics, Co...
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| Part No. |
M55SP-1
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| OCR Text |
1 outline a high-precision stepping motor "m55sp-1", 55mm in outer diameter. despite such compact body size as 23mm in thickness, it has acquired high output characteristic, excellent running quietness and stability. stepping motors featur... |
| Description |
Stepping Motors
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| File Size |
50.75K /
2 Page |
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Zarlink
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| Part No. |
MT90863
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| OCR Text |
...TL-compatible outputs IEEE-1149.1 (JTAG) Test Port Ordering Information MT90863AL MT90863AG 128 Pin MQFP 144 Pin BGA
February 2003
-40C ...23mm x 23mm Ball Pitch 1.5mm
Figure 3 - BGA Pin Connections
Zarlink Semiconductor Inc.
3
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| Description |
3V Rate Conversion Digital Switch
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| File Size |
508.93K /
43 Page |
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Integrated Device Techn...
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| Part No. |
89HPES32H8G2
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| OCR Text |
1 of 40 november 28, 2011 ? 2011 integrated device technology, inc. ? idt and the idt logo are registered trademarks of integrated device ...23mm x 23mm 484- ball flip chip bga with 1mm ball spacing product description utilizing standard pc... |
| Description |
Low latency cut-through architecture
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| File Size |
256.21K /
40 Page |
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Integrated Device Techn...
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| Part No. |
89HPES22H16
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| OCR Text |
1 of 37 october 3, 2011 ? 2011 integrated device technology, inc. ? idt and the idt logo are registered trademarks of integrated device te...23mm x 23mm 484- ball flip chip bga with 1mm ball spacing product description utilizing standard pc... |
| Description |
Low-latency cut-through switch architecture
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| File Size |
235.21K /
37 Page |
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it Online |
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Integrated Device Techn...
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| Part No. |
89HPES16H16
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| OCR Text |
1 of 36 october 3, 2011 ? 2011 integrated device technology, inc. ? idt and the idt logo are registered trademarks of integrated device te...23mm x 23mm 484- ball flip chip bga with 1mm ball spacing product description utilizing standard pc... |
| Description |
Low-latency cut-through switch architecture
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| File Size |
232.46K /
36 Page |
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it Online |
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pmc
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| Part No. |
2001654
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| OCR Text |
...L OVERVIEW
PRELIMINARY ISSUE 1: APRIL 2001
PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC.
PRELIMINARY TECHNICAL OVERVIEW PMC- 200...23mm x 23mm BGA package and implemented using low power 1.8/3.3V CMOS technology with 3.3V tolerant ... |
| Description |
From old datasheet system
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| File Size |
523.65K /
22 Page |
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it Online |
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Price and Availability
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