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Amphenol Communications Solutions |
| Part No. |
98414-F06-06LF
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| Description |
Minitek®, Wire to Board Connectors, Shrouded Header - Through Mount - Double row - 6 Positions - 2mm (0.079inch) - Vertical
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
76345-306-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 6 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Panasonic Corporation
PANASONIC[Panasonic Semiconductor]
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| Part No. |
LNA2606L
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| Description |
HEADER, VERTICAL, 1ROW, 6WAY; Connector type:Wire-to-Board; Gender:Plug; Ways, No. of:6; Pitch, lead:2mm; Termination method:Solder; Material, contact:Brass; Plating, contact: Tin; Rows, No. of:1; Colour:White; Contacts, No. of:6; RoHS Compliant: Yes
GaAlAs on GaAs Infrared Light Emitting Diode
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| File Size |
20.60K /
1 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68622-606LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Double row, Top Entry, Latched, 12 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-161606LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61082-041606LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
71600-606LF
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| Description |
Quickie IDC Receptacle, Wire to Board connector -Double row - 6 Positions - 2.54 mm (0.1 in.)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61082-164606LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 160 Positions.
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| Tech specs |
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Official Product Page
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC606LC5
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| Description |
GaAs InGaP HBT MMIC ULTRA LOW PHASE NOISE, DISTRIBUTED AMPLIFIER, 2 - 18 GHz
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| File Size |
378.93K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
67996-606LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75168-306-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 06 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
57102-S06-06LF
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| Description |
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Header, Through Hole, Double Row, 12 Positions, 2.00mm (0.078in) Pitch..
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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