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bonded-pair Datasheet PDF File

For bonded-pair Found Datasheets File :: 321 Search Time::1.906ms
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				Mosel Vitelic Corp MOSEL[Mosel Vitelic, Corp] Mosel Vitelic, Corp.
Part No.	MSS0271
OCR Text	.... IN0 and IN1 They should be bonded to ground both regularly. While abnormal lot (pitch shifted) is encountered, special bonding could be...pair SP+ and SP-. Due to a sophisticated architecture, there demands no ramp up (or ramp down) to el...
Description	2.7 VOICE ROM Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection
File Size	60.19K / 12 Page	View it Online	Download Datasheet

				Quantum Research Group ltd
Part No.	QT110-D QT110-S QT110-IS QT110H-IS QT110H-S
OCR Text	... smaller if they are physically bonded to other surfaces, for example a wall or floor. 1.3.4 f ield s haping the electrode can be prevented...pair, it is possible for ground-bounce to cause damage to the out pin; even though the transients ar...
Description	Charge-transfer touch sensor IC-SMD-QPROX SENSOR IC-QPROX SENSOR
File Size	208.18K / 12 Page	View it Online	Download Datasheet

				Zarlink
Part No.	MT88E46 107
OCR Text	... No Connection. This pin is not bonded to the die and is unaffected by external connections. Carrier Detect (CMOS Logic Output). Active low....pair of the telephone hybrid or speech IC. The signal can be amplified or attenuated at GS2 via sele...
Description	Bellcore Compliant Calling Number Identification Circuit From old datasheet system
File Size	506.87K / 23 Page	View it Online	Download Datasheet

				Zarlink Semiconductor, Inc. Zarlink Semiconductor Inc.
Part No.	MT88E46 MT88E46AS
OCR Text	... No Connection. This pin is not bonded to the die and is unaffected by external connections. Carrier Detect (CMOS Logic Output). Active low....pair of the telephone hybrid or speech IC. The signal can be amplified or attenuated at GS2 via sele...
Description	Bellcore Compliant Calling Number Identification Circuit TELEPHONE CALLING NO IDENT CKT, PDSO20 Dual inputs (tip/ring and 4 wire) Bellcore compliant Extended Voltage Calling Number Identification Circuit for CID, CIDCW and CWD (Type 2 and 2.5)
File Size	510.04K / 23 Page	View it Online	Download Datasheet

				Mitel Networks Corporation Mitel Networks, Corp.
Part No.	MT88E46
OCR Text	...no connection. this pin is not bonded to the die and is unaffected by external connections. 14 cd carrier detect (cmos logic output). acti...pair of the telephone hybrid or speech ic. the signal can be ampli?ed or attenuated at gs2 via selec...
Description	Bellcore Compliant Calling Number Identification Circuit(兼容贝尔内核主叫识别电路) 贝尔通讯兼容主叫号码识别电路（兼容贝尔内核主叫识别电路）
File Size	116.78K / 25 Page	View it Online	Download Datasheet

				Holtek Semiconductor Inc Holtek Semiconductor In...
Part No.	HT604L03 HT614
OCR Text	... which is left open and not bonded out. oscillator frequency vs. supply voltage the recommended oscillator frequency is f oscd (decoder) f osce (encoder) ht604l/ht614/ht692 rev. 1.10 5 january 24, 2003 , 6 ' , 6 ...
Description	318 Series of Decoders 318 Series of Decoders
File Size	150.80K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	OQ2538HP OQ2538U
OCR Text	...all gnd and v ee pads must be bonded; do not leave one single gnd or v ee pad unconnected! 3. pads denoted n.c. should not be connected. ...pair in and inq and to the output signal pair out and outq. the two lines in each pair should have t...
Description	SDH/SONET STM16/OC48 main amplifiers
File Size	172.50K / 24 Page	View it Online	Download Datasheet

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