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				SKYWORKS SOLUTIONS INC
Part No.	CME7660-203
OCR Text	...ly and handling procedure die attach methods universal chips are compatible wit h both eutectic and conductive epoxy die attach methods. eutectic composition p re forms of au/sn or au/ge are useful when soldering devices in circuit....
Description	SILICON, MIXER DIODE
File Size	537.01K / 9 Page	View it Online	Download Datasheet


Part No.	CME7660-000
OCR Text	...mbly and handling procedure die attach methods all universal chips are compatible with both eutectic and conductive epoxy die attach methods. eutectic composition preforms of au/sn or au/ge are useful when soldering devices in circuit. gold...
Description	SILICON, MEDIUM BARRIER SCHOTTKY, KU BAND, MIXER DIODE
File Size	83.31K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC9981108
OCR Text	...g2 gate control 2 for amplifer. attach bypass capacitor per application circuit herein. f or nominal operation +9.5v should be applied to vgg2. 4, 7 acg2, acg4 low frequency termination. attach bypass capacitor per application circu...
Description	GaAs PHEMT MMIC 2 WATT POWER AMPLIFIER, 0.1 - 22 GHz
File Size	558.91K / 10 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC637LP5 HMC637LP5E
OCR Text	...to vgg2 for nominal operation. attach bypass capacitor per application circuit herein. 5 rfin this pad is dc coupled and matched to 50 o hms. 13 vgg1 gate control 1 for amplifer. attach bypass capacitor per application circuit herein. ...
Description	GaAs MESFET MMIC 1 WATT POWER AMPLIFIER, DC - 6 GHz
File Size	302.96K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC634
OCR Text	... way to accom- plish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (figure 2). microstrip substrates should brought as close to th...
Description	GaAs PHEMT MMIC DRIVER AMPLIFIER, 5 - 20 GHz
File Size	288.86K / 8 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	28333-PCN-001-A
OCR Text	attach change for etqfp package ds3/e3/sts-1 liu framer rev. 12/98 page 1 of 2 dear valued customer: this notification is for the purpose of informing you of a change by conexant systems/mindspeed technologies in the package mold compound a...
Description	Mold Compound and Die attach Change for ETQFP Package
File Size	12.34K / 2 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC51809
OCR Text	... way to accom- plish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (figure 2). microstrip substrates should brought as close to th...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz
File Size	257.20K / 6 Page	View it Online	Download Datasheet

				Analog Microelectronics
Part No.	AME8804AEEVZ AME8804AEEVL AME880412 AME8804BEEVADJY AME8804BEEVADJZ AME8804AEEVY AME8804AEEYZ
OCR Text	...3. en 4. pg 5. adj 6. out * die attach: non-conductive epoxy sot-25 /tsot-25 top view ame8804aeev 1. in 2. gnd 3. en 4. adj 5. out * die attach: conductive epoxy sot-26/tsot-26 top view 1 3 2 5 4 ame8804 sot-25 /tsot-25 top view 1 3 2 5...
Description	300mA CMOS LDO
File Size	164.75K / 18 Page	View it Online	Download Datasheet

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