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  90897-1162 Datasheet PDF File

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    45985-1162

Molex Electronics Ltd.
Part No. 45985-1162
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Header, Right Angle,10 Power Contacts, 32 Signal Contacts, Select Gold (Au) Plating, for 2.36mm (.093) Thick PC Board
File Size 480.58K  /  7 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. 2SA1162
Description PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
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HUA FENG CIRCUIT





    45984-1162

Molex Electronics Ltd.
Part No. 45984-1162
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header, Right Angle, 10 Power
File Size 451.77K  /  7 Page

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Amphenol Communications Solutions
Part No. 79821-162HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
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    3-111623-0 111623-3 111623-4 111623-5 111623-6 111623-7 111623-1 111623-2 111623-8 1-111623-8 1-111623-2 1-111623-1 1-11

Tyco Electronics
Part No. 3-111623-0 111623-3 111623-4 111623-5 111623-6 111623-7 111623-1 111623-2 111623-8 1-111623-8 1-111623-2 1-111623-1 1-111623-0 1-111623-3 1-111623-9 1-111623-5 1-111623-4 1-111623-6 1-111623-7 2-111623-0 3-111623-1
Description RECEPTACLE ASSY, POLARIZED
File Size 198.78K  /  1 Page

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Amphenol Communications Solutions
Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

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    SGS Thomson Microelectronics
Part No. AN1162
Description POWER CONSUMPTION COMPARISON BETWEEN 3V M29 SERIES FLASH MEMORIES
File Size 25.01K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

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    LG Semicon
Part No. GL1162
Description VIDEO AMPLIFIER
File Size 537.93K  /  9 Page

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Amphenol Communications Solutions
Part No. 77311-162-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
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    Agilent(Hewlett-Packard...
Part No. U1162A
Description Agilent U1210 Series Handheld Clamp Meters
File Size 449.27K  /  17 Page

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Amphenol Communications Solutions
Part No. 50332-1162HLF
Description High Pin Count, Backplane Connectors, Receptacle, Vertical, Through Hole, 3 Row, 162 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
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    MACOM[Tyco Electronics]
Part No. PA1162
Description 800-960 MHz(4 Watt Ultra Linear Power Amplifier)
File Size 54.50K  /  1 Page

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Amphenol Communications Solutions
Part No. 68021-162HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

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    Semtech
Part No. SC1162 SC1163
Description PROGRAMMABLE SYNCHRONOUS DC/DC CONVERTER, LOW DROPOUT REGULATOR CONTROLLER
File Size 236.34K  /  12 Page

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Amphenol Communications Solutions
Part No. 10106116-2002401LF
Description PwrBlade+® , Power Connectors, 2ACP+8S STB, Right Angle, Header.
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    0908972163 90897-2163

Molex Electronics Ltd.
Part No. 0908972163 90897-2163
Description 2.54mm (.100) Pitch QF-50, Right Angle, Dual Row with Eject Levers, Shrouded Header, 16 Circuits, Strain Relief
File Size 257.67K  /  3 Page

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Amphenol Communications Solutions
Part No. 54122-811162000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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    90897-1141 0908971141

Molex Electronics Ltd.
Part No. 90897-1141 0908971141
Description 2.54mm (.100) Pitch QF-50, Right Angle, Dual Row with Eject Levers, Shrouded Header
File Size 257.68K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-4116-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

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