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  70567-0275 Datasheet PDF File

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    A-70567-0020

Molex Electronics Ltd.
Part No. A-70567-0020
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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Texas Instruments

Part No. TLV716120275PDPQR
Description Dual-Channel, Capless, 150mA Low-Dropout (LDO) Regulator 6-X2SON -40 to 125
Tech specs    

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    A-70567-0019

Molex Electronics Ltd.
Part No. A-70567-0019
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Texas Instruments

Part No. TLV716120275PDPQT
Description Dual-Channel, Capless, 150mA Low-Dropout (LDO) Regulator 6-X2SON -40 to 125
Tech specs    

Official Product Page

    70567-0018

Molex Electronics Ltd.
Part No. 70567-0018
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

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    A-70567-0014 15-80-0321

Molex Electronics Ltd.
Part No. A-70567-0014 15-80-0321
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating

File Size 1,218.23K  /  7 Page

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    A-70567-0364 15-80-1521

Molex Electronics Ltd.
Part No. A-70567-0364 15-80-1521
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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    70567-0016 A-70567-0016 15-81-0361

Molex Electronics Ltd.
Part No. 70567-0016 A-70567-0016 15-81-0361
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

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    70567-0143 15-80-0185

Molex Electronics Ltd.
Part No. 70567-0143 15-80-0185
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    70567-0013 A-70567-0013 15-80-0301

Molex Electronics Ltd.
Part No. 70567-0013 A-70567-0013 15-80-0301
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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    Molex, Inc.
Part No. 43810-0272 43810-0275
Description MF SMC RA HDR w/o Clip Tin 18Ckt 18 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
MF SMC RA HDR w/o Clip Tin 24Ckt 24 CONTACT(S), MALE, POWER CONNECTOR, SOLDER

File Size 134.15K  /  2 Page

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    050909-0275

ITT Industries
Part No. 050909-0275
Description D*M High reliable D-Sub Connectors with crimp termination

File Size 30.03K  /  1 Page

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