44067-0402 pdf Datasheet P2 Part Num --- IC-ON-LINE

Texas Instruments

Part No.

JM38510/50402BRA

Description

Standard High-Speed PAL Circuits 20-CDIP -55 to 125

Tech specs

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44067-0402 Datasheet PDF File

For 44067-0402 Found Datasheets File :: 150+ Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				Molex Electronics Ltd.
Part No.	44067-0603 0440670603
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0440672002 44067-2002
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating MOLEX Connector
File Size	204.10K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1802 0440671802
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
File Size	203.99K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1801 0440671801
Description	3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating
File Size	203.94K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0440672201 44067-2201
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) MOLEX Connector
File Size	204.11K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-0802 0440670802
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0440671001 44067-1001
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") MOLEX Connector
File Size	204.09K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0440672402 44067-2402
Description	3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating MOLEX Connector
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0440672403 44067-2403
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating MOLEX Connector
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1201 0440671201
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating 3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating
File Size	204.11K / 3 Page	View it Online	Download Datasheet

For 44067-0402 Found Datasheets File :: 150+ Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |