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Vishay Intertechnology, Inc.
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| Part No. |
P4C169-20DC P4C169-25DC P4C169-15DC P4C170-25DC P4C169-12DC
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| Description |
3-1/2 Digit A/D, w/LCD Driver, -25C to 85C, 44-MQFP, tray
3-1/2 Digit A/D, w/ LCD Driver, 0C to 70C, 40-PDIP, TUBE
3-1/2 Digit A/D, w/ LCD Driver, 0C to 70C, 44-MQFP, T/R
3-1/2 Digit A/D, w/ Hold, 0C to 70C, 44-MQFP, tray x4的SRAM
x4 SRAM
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| File Size |
461.18K /
8 Page |
 View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
87914-2815 0879142815
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, tray Packaging, Lead-free
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| File Size |
3,777.37K /
48 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
87914-2216 0879142216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
87914-3616 0879143616
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, tray Packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0528304422 52830-4422
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| Description |
Modular Jack, Right Angle, 4/4, 0.38渭m (15渭") Gold (Au) Plating, with Beveled MetalPins, tray Packaging, Lead-free
Modular Jack, Right Angle, 4/4, 0.38μm (15μ) Gold (Au) Plating, with Beveled MetalPins, tray Packaging, Lead-free
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| File Size |
112.82K /
3 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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