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wire-bond Datasheet PDF File

For wire-bond Found Datasheets File :: 3390 Search Time::4.954ms
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				AVAGO TECHNOLOGIES LIMITED
Part No.	ASMT-JB11-NMP01
OCR Text	... fexibility to encapsulated wire bond and die attach. this characteristic provides the ability to absorb thermal stress during the soldering process and during operation as well. the chemical structure of silicone provides ...
Description	Silicone Encapsulation for LED Advantages and Handling Precautions
File Size	37.63K / 2 Page	View it Online	Download Datasheet

				Hittite
Part No.	HMC1105
OCR Text	...ible in order to minimize bond wire length. typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). handling precautions follow these precautions to avoid permanent damage. storage: all bare die are placed in either waffle...
Description	GaAs MMIC x2 PASSIVE FREQUENCY MULTIPLIER
File Size	250.49K / 6 Page	View it Online	Download Datasheet

				SIGE[SiGe Semiconductor, Inc.] SIGE[SiGe Semiconductor Inc.]
Part No.	SE1050W
OCR Text	...ngle-ended or 100 differential wire bond selectable outputs Bandwidth (-3 dB) = 9.8 GHz Operates at OC-192 / STM-64 up to 10.7 Gb/s NRZ rates Power supply rejection for both single ended and differential modes of operation Optimized for PI...
Description	LightCharger⑩ 10 Gb/s Transimpedance Amplifier Final LightCharger 10 Gb/s Transimpedance Amplifier Final
File Size	132.54K / 11 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC[ETC]
Part No.	TC1102
OCR Text	...rmo-compression or thermo-sonic wire bonding. ELECTRICAL SPECIFICATIONS (TA=25 C) Symbol NF Ga IDSS gm VP BVDGO Rth CONDITIONS Noise Figure...bond wires. TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Shanhua Je...
Description	Super Low Noise GaAs FETs
File Size	104.59K / 4 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC26509
OCR Text	... via 0.025 mm (1 mil) diameter wire bonds of minimal length <0.31 mm (<12 mils). this downconverter ic is an excellent, smaller, and more...bond pad is .004 square. 4. bond pad spacing center to center is .006. 5. backside metallization: ...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED DOWNCONVERTER, 20 - 32 GHz
File Size	261.27K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC55409
OCR Text	...udes the para- sitic effects of wire bond assembly. connections were made with a 1 mil wire bond with minimal length (<12 mil). electrical specifi cations, t a = +25 c, if= 100 mhz, lo= +13 dbm* parameter min. typ. max. min. typ. max. ...
Description	GaAs MMIC FUNDAMENTAL MIXER, 11 - 20 GHz
File Size	225.93K / 6 Page	View it Online	Download Datasheet

				MINI-SYSTEMS INC
Part No.	MINI-SYSTEMSINC-MSAT-6G-15.5DB MSAT-7G-1.5DB MSAT-7G-16.5DB MSAT-7G-23.5DB
OCR Text	... 99.6% alumina 25k ? min. gold; wire or ribbon bondable, or solderable. 25k ? min. gold; wire or ribbon bondable, or solderable. 25k ? min. gold; wire or ribbon bondable, or solderable. 25k ? min. gold; wire or ribbon bondable, or solderabl...
Description	0 MHz - 20000 MHz RF/MICROWAVE FIXED ATTENUATOR
File Size	45.91K / 1 Page	View it Online	Download Datasheet

				TRIQUINT[TriQuint Semiconductor]
Part No.	TGA4817-EPU
OCR Text	...2/ 3/ 5/ 5/ Photodiode& Bond Wire Model: CPD = 0.2pF, RPD = 15, LBW = 1.0 nH RF Output Interconnect Inductance: 0.42nH External Bypass Capacitors Required (see assembly drawing) 10GBit/s, 2 -1 PRBS, BER < 10 31 -12 TABLE III THERMAL ...
Description	10 Gb/s Wide Dynamic Range TIA 10Gb/s Wide Dynamic Range Differential TIA
File Size	407.92K / 9 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC55309
OCR Text	...udes the para- sitic effects of wire bond assembly. connections were made with a 1 mil wire bond with minimal length (<12 mil). electrical specifi cations, t a = +25 c, if= 100 mhz, lo= +13 dbm* parameter min. typ. max. min. typ. max. ...
Description	GaAs MMIC FUNDAMENTAL MIXER, 7 - 14 GHz
File Size	215.97K / 6 Page	View it Online	Download Datasheet

				MINI-SYSTEMS INC
Part No.	MSAT-1G-05DB MSAT-1G-09DB MSAT-1G-10.5DB
OCR Text	... quartz quartz 25k ? min. gold, wire or ribbon bondable 25k ? min. gold, wire or ribbon bondable 25k ? min. gold, wire or ribbon bondable 25...bond pads bond pads bond pads bond pads bond pads backside surface backside surface backside surface...
Description	0 MHz - 20000 MHz RF/MICROWAVE FIXED ATTENUATOR
File Size	56.15K / 1 Page	View it Online	Download Datasheet

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