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substrates Datasheet PDF File

For substrates Found Datasheets File :: 1677 Search Time::6.875ms
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				Hittite Microwave Corporation
Part No.	HMC60709
OCR Text	... mil) thick alumina thin fi lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin fi lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surfac...
Description	GaAs MMIC HIGH ISOLATION SPDT SWITCH, DC - 15 GHz
File Size	211.65K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-APH478 H478
OCR Text	...(5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface o...
Description	18000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER GaAs HEMT MMIC 1 WATT POWER AMPLIFIER, 18 - 20 GHz GaAs HEMT MMIC POWER AMPLIFIER
File Size	205.07K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corporati...
Part No.	HMC26009
OCR Text	... mil) thick alumina thin fi lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin fi lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surf...
Description	GaAs MMIC FUNDAMENTAL MIXER, 14 - 26 GHz
File Size	224.64K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH14007
OCR Text	...(5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface o...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 24 - 40 GHz
File Size	175.10K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC33909
OCR Text	... mil) thick alumina thin fi lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin fi lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surf...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 33 - 42 GHz
File Size	308.29K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC55509
OCR Text	... mil) thick alumina thin fi lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin fi lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surfac...
Description	GaAs MMIC I/Q MIXER 31 - 38 GHz
File Size	242.81K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC383
OCR Text	...(5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface o...
Description	GAAS PHEMT MMIC MEDIUM POWER AMPLIFIER, 12 - 30 GHZ
File Size	329.93K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC33809
OCR Text	...(5 mil) thick alumina thin lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surfac...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 26 - 33 GHz
File Size	302.54K / 8 Page	View it Online	Download Datasheet

				RHOPOINT COMPONENTS
Part No.	CC2520FC CC2015FC CC1512FC
OCR Text	...Now combination with resistance substrates such as IMS Resistance the* Typeto receiveconductivitywire to optimize high outstandingto 10,000 power ratings and These ratings are based on pre-stress All continuous duty. 80 Thermal resistance i...
Description	Type CC Low Resistance Precision Chip Resistors
File Size	535.82K / 2 Page	View it Online	Download Datasheet

				KEMET Corporation
Part No.	MA4E2544L-1282
OCR Text	...re solder attachment onto hard substrates. 80au/20sn and sn63/pb37 solders are acceptable for usage. die a ttach for hard substrates, we recommend utilizing a vacuum tip and force of 60 to 100 grams applied uniformly to the top su...
Description	SURMOUNTTM Low Barrier Silicon Schottky Cross-Over Quad Series SURMOUNTTM低门槛硅肖特基交叉四系列
File Size	106.75K / 4 Page	View it Online	Download Datasheet

For substrates Found Datasheets File :: 1677 Search Time::6.875ms
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