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Micronas Semiconductor Holding AG
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| Part No. |
MSP3457G MSP3407G
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| OCR Text |
...5.2. btsc-stereo 30 3.5.3. btsc-sap with sap at loudspeaker channel 31 3.5.4. fm-stereo radio 31 3.5.5. automatic standard detection 31 3.5....8. analog performance 53 4.6.3.9. sound standard dependent characteristics 57 5. appendix a: overvie... |
| Description |
Multistandard Sound Processor Family
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| File Size |
548.14K /
81 Page |
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聚兴科技股份有限公司
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| Part No. |
AT25F512AN-10SH-2.7
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| OCR Text |
... ? 8-lead jedec soic and 8-lead sap packages description the at25f512a provides 524,288 bits of serial reprogrammable flash memory orga- nized as 65,536 words of 8 bits each. the device is optimized for use in many industrial and commercial... |
| Description |
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| File Size |
440.17K /
19 Page |
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it Online |
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Micronas Semiconductor Holding AG
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| Part No. |
MSP4458 MSP4408G
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| OCR Text |
...5.2. btsc-stereo 34 3.5.3. btsc-sap with sap at main channel 35 3.5.4. fm-stereo radio 35 3.5.5. automatic standard detection 35 3.5.6. soft...8. power supply rejection 63 4.6.3.9. analog performance 66 4.6.3.10. sound standard dependent chara... |
| Description |
Multistandard Sound Processor 多标准声音处理器
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| File Size |
682.31K /
85 Page |
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it Online |
Download Datasheet |
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NTE[NTE Electronics]
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| Part No. |
NTE1800
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| OCR Text |
...e package that incorporates the SAP demodulation and the L, R matrix circuits required to demodulate multiplexed sound signals on the US NTS...8.0 to 13.2V power supply D 300mVrms (MONO) composite signal input voltage D 30-pin plastic shrink D... |
| Description |
Integrated Circuit TV Multiplex Sound Decoder
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| File Size |
23.09K /
3 Page |
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it Online |
Download Datasheet |
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NTE[NTE Electronics]
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| Part No. |
NTE1860
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| OCR Text |
...coding, filters for stereo, and SAP (Separate Audio Program) demodulation applications. Features: D Low number of external parts D Excellent...8 Typ -0.1 Max 0.6 Unit dB
SAP Distortion Ratio
THDSAP
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4.0
8.0
%
SAP BPF Freq... |
| Description |
Integrated Circuit TV Stereo Multiplexing Decoder
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| File Size |
97.12K /
5 Page |
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it Online |
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聚兴科技股份有限公司
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| Part No. |
AT25128AW-10SU-1.8 AT25128AW-10SU-2.7
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| OCR Text |
... cs so wp gnd 8-lead ultra thin sap vcc hold sck s i cs so wp gnd 1 2 3 4 8 7 6 5 8-ball dbga2 bottom view bottom view features ? serial peripheral interface (spi) compatible ? supports spi modes 0 (0,0) and 3 (1,1) ? data sheet describes... |
| Description |
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| File Size |
420.44K /
24 Page |
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it Online |
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聚兴科技股份有限公司
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| Part No. |
AT25FS040N-SH27-B AT25FS040N-SH27-T
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| OCR Text |
...ltra thin small ar ray package (sap) die sales: waffer form, tape and reel, and bumped wafers description the at25fs040 provides 4,194,304...8 bits each . the device is optimized for use in many industrial and commercial applications w here ... |
| Description |
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| File Size |
542.83K /
25 Page |
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it Online |
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