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clad Datasheet PDF File

For clad Found Datasheets File :: 3214 Search Time::1.625ms
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				ON Semiconductor
Part No.	BAS16DXV6T1/D BAS16DXV6T1 BAS16XV2T1
OCR Text	...num core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dis- sipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher...
Description	ICS SRAM 32KX8-12NS SMD General Switching Diode 75V
File Size	65.82K / 6 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	BSS64LT1/D
OCR Text	...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher t...
Description	Driver Transistor NPN Silicon(80V硅NPN驱动器晶体管)
File Size	35.57K / 4 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	MMBF5457LT1
OCR Text	...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher ...
Description	Small Signal JFET
File Size	61.91K / 6 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V.
Part No.	BCP53-16T3 BCP53-10T3 BCP53-16T1 BCP53-10T1
OCR Text	...inum core board such as thermal clad ? . using a board material such as thermal clad, a higher power dissipation of 1.6 watts can be achieved using the same footprint. interface between the board and the package. with the correct pad geomet...
Description	TRANSISTOR \| BJT \| PNP \| 80V V(BR)CEO \| 1.5A I(C) \| SOT-223 晶体管\|晶体管\|进步党\| 80V的五（巴西）总裁\| 1.5AI（丙）\|的SOT - 223
File Size	49.48K / 4 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	MMBF5457LT1-D
OCR Text	...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher ...
Description	JFET - General Purpose Transistor N-Channel
File Size	60.87K / 8 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	MMSD914T1-D MMSD914T3
OCR Text	...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher t...
Description	Switching Diode
File Size	41.79K / 4 Page	View it Online	Download Datasheet

				NEC[NEC]
Part No.	UPC8106 UPC8106TB UPC8106TB-E3 UPC8109TB UPC8109TB-E3 UPC8163TB
OCR Text	... Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB TA = +85 C Rating 6.0 6.0 200 Unit V V mW Operating Ambient Temperature Storage Temperature Maximum Input Power TA Tstg Pin -40 to +85 -55 to +150 +10 C C dBm...
Description	SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES
File Size	174.58K / 24 Page	View it Online	Download Datasheet

For clad Found Datasheets File :: 3214 Search Time::1.625ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |