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Amphenol Communications Solutions |
| Part No. |
93135-004LF
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| Description |
PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-107081350LF
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| Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 8 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-110301350LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 30 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Vishay Siliconix
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| Part No. |
6N113508 6N1136-X006 6N1136-X007 6N1136-X009 6N1136 6N1135-X007
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| Description |
High Speed Optocoupler, 1 MBd, Photodiode with Transistor Output, 110 ∑C Rated
High Speed Optocoupler, 1 MBd, Photodiode with Transistor Output, 110 °C Rated
High Speed Optocoupler, 1 MBd, Photodiode with Transistor Output, 110 掳C Rated
High Speed Optocoupler, 1 MBd, Photodiode with Transistor Output, 110 隆?C Rated
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| File Size |
157.41K /
10 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
93135-003LF
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| Description |
PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-808301350LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-109121350LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-108321350LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 32 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-107101350LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-809361350LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 36 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Maxim Integrated Products, Inc.
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| Part No. |
DS1350YL-70-IND DS1350YL-70IND DS1350YL-100IND
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| Description |
512K X 8 NON-VOLATILE SRAM MODULE, 70 ns, PDSO34 LOW PROFILE, SMT-34
512K X 8 NON-VOLATILE SRAM MODULE, 70 ns, DMA34
512K X 8 NON-VOLATILE SRAM MODULE, 70 ns, DFP34
512K X 8 NON-VOLATILE SRAM MODULE, 100 ns, DFP34
512K X 8 NON-VOLATILE SRAM MODULE, 100 ns, PDSO34 LOW PROFILE, SMT-34
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| File Size |
161.19K /
9 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54122-810321350LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 135110-00 |
| Maker: UMAX |
| Pack: QFP |
| Stock: 387 |
| Unit price
for : |
|
50: $10.98 |
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100: $10.44 |
| 1000:
$9.89 |
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Email: oulindz@gmail.com |
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