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  TOT-5361 Datasheet PDF File

For TOT-5361 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    W536090T W536120T W536060T W536030T

WINBOND[Winbond]
Part No. W536090T W536120T W536060T W536030T
Description VOICE/MELODY/LCD CONTROLLER
File Size 282.24K  /  16 Page

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Amphenol Communications Solutions
Part No. 53610-S50-4LF
Description Quickie® IDC Cable-to-Board Connector System, Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    W536030A W536060A W536090A W536120A

Winbond Electronics
WINBOND[Winbond]
Part No. W536030A W536060A W536090A W536120A
Description MDPCM Voice/Melody w/64x16 ~ 40x8 LCD, 256x4x2 LCD RAM, 1/8&1/16 Duty, 1/4&1/5 Bias, 32Kx20 ROM, 1.4
VOICE/ MELODY / LCD CONTROLLER
File Size 95.57K  /  12 Page

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Amphenol Communications Solutions
Part No. 53610-S20-4LF
Description Quickie® IDC Cable-to-Board Connector System, Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    WINBOND[Winbond]
Part No. W536120P W536030P W536060P W536090P
Description VOICE & MELODY CONTROLLER
File Size 277.52K  /  14 Page

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Amphenol Communications Solutions
Part No. 53611-G40-8LF
Description Quickie Header, Wire to Board Connector, Double Row, 40 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

   
Part No. HYM536120AW-80 HYM536120AW-60 HYM536120ALWG-60 HYM536120ALW-60 HYM536120ALW-80
Description x36 Fast Page Mode DRAM Module
File Size 240.54K  /  9 Page

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Amphenol Communications Solutions
Part No. 53611-G34-4LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

    FAN53610AUC29X

ON Semiconductor
Part No. FAN53610AUC29X
Description 3 MHz, 600 mA / 1A Synchronous Buck Regulator
File Size 1,173.18K  /  16 Page

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Amphenol Communications Solutions
Part No. 53612-S26-8
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

    KMM5361205C2WG KMM5361205C2W

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. KMM5361205C2WG KMM5361205C2W
Description 1M x 36 DRAM SIMM using 1Mx16 and 4M Quad CAS EDO, 1K Refresh
File Size 281.12K  /  17 Page

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Amphenol Communications Solutions
Part No. 53612-G26-6
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

    KMM53616004BKG KMM53616004BK

SAMSUNG[Samsung semiconductor]
Part No. KMM53616004BKG KMM53616004BK
Description 16M x 36 DRAM SIMM Using 16Mx4 & 16Mx1, 4K Refresh, 5V
File Size 407.09K  /  19 Page

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Amphenol Communications Solutions
Part No. 53611-G10-8LF
Description Quickie Header, Wire to Board Connector, Double Row, 10 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

    KMM53616000BKG KMM53616000BK

SAMSUNG[Samsung semiconductor]
Part No. KMM53616000BKG KMM53616000BK
Description 16M x 36 DRAM SIMM Using 16Mx4 & 16Mx1, 4K Refresh, 5V
File Size 362.68K  /  18 Page

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Amphenol Communications Solutions
Part No. 53611-G26-6LF
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

    KMM53616004CK KMM53616004CKG

SAMSUNG[Samsung semiconductor]
Part No. KMM53616004CK KMM53616004CKG
Description 16M x 36 DRAM SIMM Using 16Mx4 & 16Mx1, 4K Refresh, 5V
File Size 443.65K  /  21 Page

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Amphenol Communications Solutions
Part No. 53610-S14-6
Description Quickie Header, Wire to Board Connector, Double Row, 14 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. KMM5361203C2WG KMM5361203C2W
Description 1M x 36 DRAM SIMM using 1Mx16 and 1Mx4 Quad CAS, 1K Refresh
File Size 272.21K  /  17 Page

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Amphenol Communications Solutions
Part No. 53612-S40-4LF
Description Quickie® IDC Cable-to-Board Connector System, Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

For TOT-5361 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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